Layered structure for use with high power light emitting diode systems
DCFirst Claim
1. A layered structure for use with a high power light emitting diode system, comprising:
- an electrically insulating intermediate layer interconnecting a top layer and a bottom layer;
the top layer, the intermediate layer, and the bottom layer forming an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis, the at least semi-flexible elongate member being bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of 1 inch; and
the top layer being pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.
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Abstract
A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.
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Citations
20 Claims
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1. A layered structure for use with a high power light emitting diode system, comprising:
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an electrically insulating intermediate layer interconnecting a top layer and a bottom layer; the top layer, the intermediate layer, and the bottom layer forming an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis, the at least semi-flexible elongate member being bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of 1 inch; and the top layer being pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A layered structure for use with a high power light emitting diode system, comprising:
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a top layer including 0.5 to 4.0 ounces per square foot of copper having first electrical circuits and protective coating, the top layer being configured and arranged to receive at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared; a bottom layer including 0.5 to 4.0 ounces per square foot of copper having second electrical circuits; an electrically insulating intermediate layer including fiberglass 0.005 to 0.020 inch thick, the intermediate layer interconnecting the top layer and the bottom layer; a thermally conductive adhesive layer operatively connected to the bottom layer on an opposing side to the intermediate layer; and the top, intermediate, bottom, and adhesive layers having a thermal resistance of less than 5 degrees Celsius per Watt. - View Dependent Claims (9, 10, 11)
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12. A method of making a layered structure, comprising:
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obtaining a first layer made of a first electrically conductive material; obtaining a second layer made of a second electrically conductive material; obtaining an intermediate layer made of an electrically insulating thermally conductive material; sandwiching the intermediate layer between the first layer and the second layer; placing a first electrical circuit on a top surface of the first layer; coating a portion of the top surface with a protective coating; placing a second electrical circuit on a bottom surface of the second layer; connecting a plurality of high wattage electrical components to the first electrical circuit, the high wattage electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method of connecting a layered structure to a heat sink, the layered structure including an electrically insulating intermediate layer interconnecting a top layer and a bottom layer, a thermally conductive adhesive layer connected to the bottom layer, the adhesive layer including a removable backing, the top layer, the intermediate layer, the bottom layer, and the adhesive layer forming an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis, the at least semi-flexible elongate member being bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of 1 inch, the top layer being pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared, comprising:
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determining a desired length of the layered structure; cutting the layered structure into the desired length; removing the backing from the adhesive layer of the desired length; placing the desired length on a heat sink; applying pressure on the desired length; and connecting a termination board to the desired length. - View Dependent Claims (20)
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Specification