Electronic paper
First Claim
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1. A display device comprising:
- a first insulating film and a second insulating film facing each other; and
an element formation layer provided between the first insulating film and the second insulating film,wherein the element formation layer comprises a thin film transistor comprising an oxide semiconductor,wherein the first insulating film comprises a first structure body in which a first fibrous body is impregnated with a first organic resin, andwherein the second insulating film comprises a second structure body in which a second fibrous body is impregnated with a second organic resin.
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Abstract
An object of the present invention is to increase the resistance of electronic paper to external stress. The resistance to external stress is increased by providing an element formation layer, which includes an integrated circuit portion, a first electrode, a second electrode, and a charged particle-containing layer, between a first insulating film including a first structure body in which a first fibrous body is impregnated with a first organic resin, and a second insulating film including a second structure body in which a second fibrous body is impregnated with a second organic resin.
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Citations
40 Claims
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1. A display device comprising:
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a first insulating film and a second insulating film facing each other; and an element formation layer provided between the first insulating film and the second insulating film, wherein the element formation layer comprises a thin film transistor comprising an oxide semiconductor, wherein the first insulating film comprises a first structure body in which a first fibrous body is impregnated with a first organic resin, and wherein the second insulating film comprises a second structure body in which a second fibrous body is impregnated with a second organic resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A display device comprising:
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a first insulating film and a second insulating film facing each other; and an element formation layer provided between the first insulating film and the second insulating film, wherein the element formation layer comprises a thin film transistor comprising an oxide semiconductor, wherein the first insulating film comprises a first structure body in which a first fibrous body is impregnated with a first organic resin, and a first protective film having a modulus of elasticity lower than that of the first structure body, and wherein the second insulating film comprises a second structure body in which a second fibrous body is impregnated with a second organic resin, and a second protective film having a modulus of elasticity lower than that of the second structure body. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An electronic paper comprising:
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a first insulating film comprising a first structure body in which a first fibrous body is impregnated with a first organic resin; an element formation layer provided over the first insulating film; and a second insulating film provided over the element formation layer, the second insulating film comprising a second structure body in which a second fibrous body is impregnated with a second organic resin, wherein the element formation layer comprises a thin film transistor comprising an oxide semiconductor. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. An electronic paper comprising:
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a first insulating film; an element formation layer provided over the first insulating film; and a second insulating film provided over the element formation layer, wherein the element formation layer comprises a thin film transistor comprising an oxide semiconductor, wherein the first insulating film comprises a first structure body in which a first fibrous body is impregnated with a first organic resin, and a first protective film having a modulus of elasticity lower than that of the first structure body, and wherein the second insulating film comprises a second structure body in which a second fibrous body is impregnated with a second organic resin, and a second protective film having a modulus of elasticity lower than that of the second structure body. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification