Low-cost receiver using tracking filter
First Claim
1. A receiver, comprising:
- a tracking bandpass filter having a first input for receiving a radio frequency (RF) input signal, and an output, wherein said tracking handpass filter comprises;
a first portion disposed on a semiconductor die; and
at least one inductor disposed on an integrated passive device (IPD) die, said at least one inductor operatively coupled to said first portion of said tracking bandpass filter, anda signal processing circuit intergrated on said semiconductor die and having an input coupled to said output of said tracking bandpass filter, and an output for providing a processed signal,said semiconductor die and said IPD die integrated into a single multi-chip module (MCM).
1 Assignment
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Accused Products
Abstract
A receiver (400) includes a tracking bandpass filter (420) and a signal processing circuit (430-480). The tracking bandpass filter (420) has a first input for receiving a radio frequency (RF) signal, and an output, and includes a first portion (731) on a semiconductor die (730), and at least one inductor (721). The at least one inductor (721) is operatively coupled to the first portion of the tracking bandpass filter (420). The signal processing circuit (430-480) has an input coupled to the output of the tracking bandpass filter (420), and an output for providing a processed signal. The semiconductor die (730) and the at least one inductor (721) are integrated into a single multi-chip module (MCM) (710).
33 Citations
20 Claims
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1. A receiver, comprising:
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a tracking bandpass filter having a first input for receiving a radio frequency (RF) input signal, and an output, wherein said tracking handpass filter comprises; a first portion disposed on a semiconductor die; and at least one inductor disposed on an integrated passive device (IPD) die, said at least one inductor operatively coupled to said first portion of said tracking bandpass filter, and a signal processing circuit intergrated on said semiconductor die and having an input coupled to said output of said tracking bandpass filter, and an output for providing a processed signal, said semiconductor die and said IPD die integrated into a single multi-chip module (MCM). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A receiver comprising:
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a tracking bandpass filter having a first input for receiving a radio frequency (RF) input signal, a second input for receiving a center frequency adjustment signal, and an output, wherein said tracking bandpass filter comprises; a first portion disposed on a semiconductor die; and at least one inductor disposed on an integrated passive device (IPD) die, said at least one inductor operatively coupled to said first portion of said tracking bandpass filter; a power detector having an input coupled to said output of said tracking bandpass filter, and an output; a signal processing circuit having an input coupled to said output of said tracking bandpass filter, and an output for providing a processed signal; and a microcontroller having an input coupled to said output of said power detector, and an output coupled to said second input of said tracking bandpass filter for adjusting a center frequency of said tracking bandpass filter; and wherein said semiconductor die and said (PD die integrated into a single multi-chip module (MCM). - View Dependent Claims (10, 11, 12, 13, 14)
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15. A receiver, comprising:
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a low noise amplifier having a first input for receiving a radio frequency (RF) input signal, a second input for receiving a gain adjustment signal, and an output; a tracking bandpass filter having a first input coupled to said output of said low noise amplifier, a second input for receiving a center frequency adjustment signal, and an output, wherein said tracking bandpass filter comprises; a first portion disposed on a semiconductor die; and at least one inductor disposed on an integrated passive device (IPD) die, said at least one inductor operatively coupled to said first portion of said tracking bandpass; a local oscillator having an input for receiving a local oscillator frequency adjustment signal, and a first output for providing a first local oscillator signal at a frequency chosen to mix said output of said tracking bandpass filter to a desired intermediate frequency (IF); a mixer having a first input coupled to said output of said tracking bandpass filter, a second input coupled to said first output of said local oscillator, and a first output for providing a first IF signal at said desired intermediate frequency; a signal processing circuit having a first input coupled to said first output of said mixer, and an output for providing a processed signal; and a microcontroller having; a first output coupled to said second input of said low noise amplifier for adjusting said gain of said low noise amplifier; a second output coupled to said second input of said tracking bandpass filter for adjusting said center frequency of said tracking bandpass filter; and a third output coupled to said input of said local oscillator for adjusting said first local oscillator frequency of said local oscillator; and
wherein said semiconductor die and said IPD die are integrated into a single package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification