Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device

• US 8,145,322 B1
• Filed: 07/21/2008
• Issued: 03/27/2012
• Est. Priority Date: 07/19/2007
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Talbot, Neil Hamilton, Little, James Singleton, Greenberg, Robert J., Yao, Qingfang, Neysmith, Jordan Matthew
• Primary Examiner(s): Gedeon, Brian T
• Application Number:
  US12/177,038
• Time in Patent Office: 1,345 Days
• Field of Search: 607/54, 607115-119, 427/2.24, 298/29, 298/42, 298/46
• US Class Current: 607/115
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching

Abstract

The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.

The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.

The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

Claims

1. A method for backside processing of a polymer electrode array device, comprising:

applying a polymer layer on a substrate;

depositing a mask metal layer on the polymer and patterning the polymer;

preparing the front side of the electrode array device;

releasing the polymer from the substrate;

flipping over the polymer and fixing it on the substrate;

removing the polymer from the substrate;

processing the backside electrode opening;

removing the mask metal layer; and

releasing the electrode array device from the substrate.

2. The method according to claim 1, wherein the polymer contains polyimide.

3. The method according to claim 1, wherein the mask metal layer contains aluminum.

4. The method according to claim 1, wherein the polymer is released manually from the substrate.

5. The method according to claim 1, wherein the backside electrode opening is achieved by reactive ion etching.

6. The method according to claim 1, wherein the metal mask is removed by wet etching.