Lithography processes using phase change compositions
First Claim
Patent Images
1. A lithographic method comprising following steps:
- A) filling a mold having a patterned surface with a phase change composition at a temperature above a phase change temperature of the phase change composition, where the phase change composition is a solid below the phase change temperature and the phase change composition is a fluid above the phase change temperature;
followed by stepB) contacting the phase change composition with a substrate;
followed by stepC) hardening the phase change composition to form a patterned feature on the substrate by cooling the phase change composition to a temperature below the phase change temperature;
followed by stepD) separating the mold and the patterned feature;
optionally followed by stepE) etching the patterned feature;
optionally followed by stepF) removing the phase change composition;
optionally followed by stepG) cleaning the mold; and
optionally followed by stepH) repeating steps A) to G) reusing the mold;
to obtain a patterned feature on the substrate, with the proviso that the phase change composition comprises an organofunctional silicone wax.
1 Assignment
0 Petitions
Accused Products
Abstract
A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
-
Citations
14 Claims
-
1. A lithographic method comprising following steps:
-
A) filling a mold having a patterned surface with a phase change composition at a temperature above a phase change temperature of the phase change composition, where the phase change composition is a solid below the phase change temperature and the phase change composition is a fluid above the phase change temperature;
followed by stepB) contacting the phase change composition with a substrate;
followed by stepC) hardening the phase change composition to form a patterned feature on the substrate by cooling the phase change composition to a temperature below the phase change temperature;
followed by stepD) separating the mold and the patterned feature;
optionally followed by stepE) etching the patterned feature;
optionally followed by stepF) removing the phase change composition;
optionally followed by stepG) cleaning the mold; and
optionally followed by stepH) repeating steps A) to G) reusing the mold;
to obtain a patterned feature on the substrate, with the proviso that the phase change composition comprises an organofunctional silicone wax. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A patterned feature on a substrate prepared by a lithographic method comprising following steps:
-
A) filling a mold having a patterned surface with a phase change composition at a temperature above a phase change temperature of the phase change composition, where the phase change composition is a solid below the phase change temperature and the phase change composition is a fluid above the phase change temperature;
followed by stepB) contacting the phase change composition with a substrate;
followed by stepC) hardening the phase change composition to form a patterned feature on the substrate by cooling the phase change composition to a temperature below the phase change temperature;
followed by stepD) separating the mold and the patterned feature;
optionally followed by stepE) etching the patterned feature;
optionally followed by stepF) removing the phase change composition;
optionally followed by stepG) cleaning the mold; and
optionally followed by stepH) repeating steps A) to G) reusing the mold; to obtain a patterned feature on the substrate, with the proviso that the phase change composition comprises an organofunctional silicone wax and with the proviso that the patterned feature has dimensions on the order of 5 micrometers to 40 micrometers. - View Dependent Claims (10, 11, 12, 13, 14)
-
Specification