Hermetically sealed glass package and method of fabrication

• US 8,148,179 B2
• Filed: 03/17/2010
• Issued: 04/03/2012
• Est. Priority Date: 04/16/2003
• Status: Expired due to Term

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Aitken, Bruce G., Danielson, Paul S., Dickinson, James E. Jr., Logunov, Stephan L., Morena, Robert, Powley, Mark L., Reddy, Kamjula P., Schroeder, Joseph F. III, Streltsov, Alexander
• Primary Examiner(s): Sefer, A.
• Application Number:
  US12/725,648
• Publication Number:
  US 20100186449A1
• Time in Patent Office: 748 Days
• Field of Search: 257/40, 257 82- 83, 257 99-100, 438/22, 438/24, 313/504, 313/512
• US Class Current: 438/22
• CPC Class Codes: C03B 23/245 Hollow glass sheets
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 3/091 containing aluminium
• CPC Class Codes: C03C 3/093 containing zinc or zirconium
• CPC Class Codes: C03C 3/108 containing boron
• CPC Class Codes: C03C 8/04 containing zinc
• CPC Class Codes: C03C 8/10 containing lead
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

Claims

1. A method of forming a glass package comprising:

a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;

b) providing a glass substrate that does not absorb light at the predetermined wavelength;

c) directing a laser beam comprising light at the predetermined wavelength onto a predetermined portion of the sealing glass-plate; and

wherein the predetermined portion of the sealing glass plate absorbs light from the laser beam in an amount sufficient to heat the predetermined portion and form a hermetic seal connecting the sealing glass plate and the glass substrate plate.

2. The method according to claim 1, further comprising depositing one or more organic layers on the glass substrate plate.

3. The method according to claim 1, wherein the predetermined portion of the sealing glass plate swells in response to heating by the laser beam.

4. The method according to claim 3, wherein the sealing glass plate has the following composition:

5. The method according to claim 1, wherein the sealing glass plate is formed from a borosilicate glass comprising at least one transition or rare earth metal selected from the group consisting of iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and cerium.

6. The method according to claim 1, wherein the glass package comprises an organic light emitting display device.

7. The method according to claim 1, wherein the laser beam is directed through the substrate plate onto the sealing glass plate.

8. The method according to claim 1, wherein a coefficient of thermal expansion of the glass of the sealing glass plate is equal to or less than the coefficient of thermal expansion of the glass of the glass substrate.

9. The method according to claim 1, wherein the sealing glass plate in step a) is a laminated glass.

10. The method according to claim 9, wherein the laminated glass is a two layer glass comprising a layer that does not absorb light at the predetermined wavelength.

11. The method according to claim 10, wherein a thickness of the layer that does not absorb light at the predetermined wavelength is between about 75 microns and 150 microns.

12. A method of forming an organic light emitting diode display comprising:

a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;

b) providing a glass substrate plate that does not absorb light at the predetermined wavelength;

c) depositing one or more organic layers on the glass substrate plate;

d) heating a predetermined portion of the sealing glass plate inward of an outer edge of the sealing glass plate with a laser through the glass substrate plate; and

wherein the heating causes the predetermined portion of the sealing glass plate to swell and form a ridge that creates a gap between the sealing glass plate and the glass substrate plate, and wherein the ridge joins the sealing glass plate to the glass substrate plate with a hermetic seal.

13. The method according to claim 12, wherein the sealing glass plate is formed from a borosilicate glass comprising at least one transition or rare earth metal selected from the group consisting of iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and cerium.

14. The method according to claim 12, wherein the sealing glass plate has the following composition:

15. The method according to claim 12, wherein the sealing glass plate in step a) is a laminated glass.

16. The method according to claim 15, wherein the laminated glass is a two layer glass comprising a layer that does not absorb light at the predetermined wavelength.

17. The method according to claim 16, wherein a thickness of the layer that does not absorb light at the predetermined wavelength is between about 75 microns and 150 microns.

18. A method of forming a glass package comprising:

a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;

b) providing a glass substrate that does not absorb light at the predetermined wavelength;

c) directing a laser beam comprising light at the predetermined wavelength through the glass substrate onto a predetermined portion of the sealing glass plate; and

wherein the predetermined portion of the sealing glass plate absorbs light from the laser beam in an amount sufficient to heat the predetermined portion and connect the sealing glass plate to the glass substrate plate.

19. The method according to claim 18, wherein the sealing glass plate is lead free.