Method of making a semiconductor chip assembly with a post/base/cap heat spreader
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a post, a base, an adhesive and a conductive layer, whereinthe post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer,the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, andthe conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer;
solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
providing a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive, wherein providing the cap includes providing an etch mask that defines the cap;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and
thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.
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Accused Products
Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
60 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, an adhesive and a conductive layer, wherein the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, and the conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer; solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer; providing a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive, wherein providing the cap includes providing an etch mask that defines the cap;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive, wherein providing the cap includes providing an etch mask that defines the cap;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a first conductive layer, wherein an aperture extends through the first conductive layer; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the first conductive layer alone on the adhesive, including inserting the post into the aperture, wherein the first conductive layer extends above the adhesive, the post extends through the opening into the aperture, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the first conductive layer and is non-solidified, and a gap is located in the aperture between the post and the first conductive layer;
thenapplying heat to melt the adhesive; moving the base and the first conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the first conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in the gap; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the first conductive layer;
thendepositing a second conductive layer on the post, the adhesive and the first conductive layer;
thenproviding a conductive trace that includes a pad and a terminal, wherein the pad and the terminal include selected portions of the first conductive layer and an electrically conductive path is between the pad and the terminal; providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and is metallurgically bonded to the post;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, an adhesive and a substrate, wherein the substrate includes a conductive layer and a dielectric layer, the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified, the substrate is mounted on and extends above the adhesive, and the conductive layer extends above the dielectric layer, and a gap is located in the aperture between the post and the substrate;
thenflowing the adhesive into and upward in the gap; solidifying the adhesive;
thengrinding the post and the adhesive;
thenproviding a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive, wherein providing the cap includes providing an etch mask that defines the cap;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post, a conductive trace includes a pad, a terminal and a selected portion of the conductive layer and the pad is electrically connected to the terminal; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the substrate; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
thengrinding the post and the adhesive;
thenproviding a pad, a terminal and a cap, including providing an etch mask that defines the cap, wherein the pad includes a selected portion of the conductive layer and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and is metallurgically bonded to the post and overlaps and is adjacent to the adhesive;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and the pad is electrically connected to the terminal; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a substrate that includes a first conductive layer and a dielectric layer, wherein an aperture extends through the substrate; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
thengrinding the post and the adhesive;
thendepositing a second conductive layer on the post, the adhesive and the first conductive layer;
thenproviding a pad and a terminal that include selected portions of the conductive layers, including removing selected portions of the conductive layers; providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and is metallurgically bonded to the post;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap and the pad is electrically connected to the terminal; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (47, 48, 49, 50)
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51. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer and flow above the post and onto a top surface of the post; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thengrinding the post and the adhesive, thereby removing the adhesive from the top surface of the post;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (52, 53, 54, 55)
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56. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thengrinding the post, the adhesive and the conductive layer;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that is metallurgically bonded to the post and overlaps and is adjacent to the adhesive and includes selected portions of the conductive layer;
thenmounting a semiconductor device on the cap using a thermally conductive connection media that contacts the cap and is spaced from the post, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (57, 58, 59, 60)
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Specification