Copper bonding method
First Claim
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1. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
- depositing passivation material upon said bond pad structure;
patterning said passivation material to provide a plurality of spaced-apart regions of said passivation material spaced-apart along a first direction, defining a plurality of hiatuses, portions of said bond pad structure in superimposition with said hiatuses being exposed and spaced-apart from a crown surface of said regions a second direction, extending transversely to said first direction, and wherein patterning further includes forming one of said plurality of spaced-apart regions with a zigzag shape.
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Abstract
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.
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17 Claims
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1. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
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depositing passivation material upon said bond pad structure; patterning said passivation material to provide a plurality of spaced-apart regions of said passivation material spaced-apart along a first direction, defining a plurality of hiatuses, portions of said bond pad structure in superimposition with said hiatuses being exposed and spaced-apart from a crown surface of said regions a second direction, extending transversely to said first direction, and wherein patterning further includes forming one of said plurality of spaced-apart regions with a zigzag shape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification