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Sensing arrangement

  • US 8,148,686 B2
  • Filed: 10/07/2010
  • Issued: 04/03/2012
  • Est. Priority Date: 01/22/2003
  • Status: Expired due to Term
First Claim
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1. A sensor arrangement comprising a sensor, at least one integrated signal processing circuit for the measurement of signals from the sensor, and interconnecting wiring between the sensor and the integrated circuit, the arrangement comprising a substrate, said substrate forming at least part of said interconnecting wiring and said substrate is further arranged to serve as a part of said sensor, and wherein said substrate is of a curved form to provide a surface for a finger, wherein said sensor comprises at least an optical sensor for providing said signals, at least in part, to said integrated signal processing circuit for the measurement of said signals.

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