LED package structure

• US 8,148,739 B2
• Filed: 05/05/2010
• Issued: 04/03/2012
• Est. Priority Date: 11/26/2009
• Status: Expired due to Fees

• Current Assignee: Forward Electronics Company Limited
• Original Assignee: Forward Electronics Company Limited
• Inventors: Lan, Pei-Hsuan, Lan, Yu-Bing
• Primary Examiner(s): Nhu, David
• Application Number:
  US12/662,819
• Publication Number:
  US 20110121328A1
• Time in Patent Office: 699 Days
• Field of Search: 257/88, 257/98, 257/99, 257/104, 257/127, 257/E21.134, 257/189, 257/351, 257/E33.061, 257/E21.189, 257/E21.352
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.

Claims

1. An LED package structure, comprising:

a heatsink slug;

a positive-electrode frame;

a negative-electrode frame; and

an LED module, being electrically connected with the positive-electrode frame and the negative-electrode frame;

characterized in that;

the LED module includes a plurality of LED chips, and the heatsink slug is provided, at its surface, with a plurality of cup-like recesses, where the plurality of LED chips are each bonded, correspondingly, on a plane in the plurality of cup-like recess, and each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex configuration.

2. The LED package structure as claimed in claim 1, wherein the plurality of LED chips have at least two emission wavelengths.

3. The LED package structure as claimed in claim 1, wherein the plurality of LED chips have the same emission wavelengths.

4. The LED package structure as claimed in claim 1, wherein the plurality of LED chips include at least one blue-light LED chip.

5. The LED package structure as claimed in claim 1, further comprising an insulating body enveloping part of the heatsink slug, of the positive-electrode frame, and of the negative-electrode frame.

6. The LED package structure as claimed in claim 1, wherein the heatsink slug is a metallic heatsink slug.

7. The LED package structure as claimed in claim 1, wherein the plurality of cup-like recess is formed rectangular.