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Partitioning of electronic packages

  • US 8,148,808 B2
  • Filed: 06/02/2008
  • Issued: 04/03/2012
  • Est. Priority Date: 08/13/2007
  • Status: Active Grant
First Claim
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1. An electronic sensor package, comprising:

  • (a) an electronic component;

    (b) a sensor device, wherein said sensor device comprises a working component for sensing a condition external to said sensor device;

    (c) one or more electrical connectors, wherein said one or more electrical connectors connect said electronic component and said sensor device; and

    (d) a dam, wherein said dam is written to partition said electronic sensor package into at least a first section and a second section, wherein said sensor device is situated at least partially in said first section, wherein said electronic component is situated at least partially in said second section, wherein said first section is at least partially filled with a first fill material, wherein said second section is at least partially filled with a second fill material, and wherein said first fill material is different from said second fill material;

    wherein said electronic component and said sensor device are laterally separated from each other.

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