Power electronic module IGBT protection method and system

• US 8,148,929 B2
• Filed: 09/30/2008
• Issued: 04/03/2012
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Inventors: Wei, Lixiang, Tsuyoshi, Masahiro, Lukaszewski, Richard A.
• Primary Examiner(s): Ro, Bentsu
• Assistant Examiner(s): Dinh, Thai
• Application Number:
  US12/241,766
• Publication Number:
  US 20100080024A1
• Time in Patent Office: 1,281 Days
• Field of Search: 318/800, 318/801, 318/802, 318/344, 318/438, 318/471, 363/74, 363/77, 363/95, 363/98
• US Class Current: 318/400.26
• CPC Class Codes: H02M 1/32 Means for protecting converters other than automatic disconnection
• CPC Class Codes: H03K 17/0828 in composite switches
• CPC Class Codes: H03K 2017/0806 against excessive temperature

Abstract

A power electronics device with an improved IGBT protection mechanism is provided. More specifically, systems and methods are provided for reducing the switching frequency of an inverter module based on the junction temperature variation of the IGBT.

Claims

1. A method of delivering power to a load comprising:

activating and deactivating a solid state switch at a specified switching frequency to generate an output current waveform;

determining a junction temperature variation of the solid state switch; and

reducing the switching frequency based upon the junction temperature variation.

2. The method of claim 1, comprising increasing the switching frequency if the junction temperature variation is lower than a specified low temperature.

3. The method of claim 2, wherein the switching frequency is reduced if the temperature difference is higher than 60 degrees Celsius and is increased thereafter if the temperature difference is lower than approximately 55 degrees Celsius.

4. The method of claim 1, wherein determining a junction temperature variation of the solid state switch comprises estimating a power loss of the solid state switch.

5. The method of claim 1, wherein determining a junction temperature variation of the solid state switch comprises determining a thermal impedance between the solid state switch and a case to which the solid state switch is mounted.

6. The method of claim 1, wherein determining the junction temperature variation comprises calculating a boost factor.

7. The method of claim 1, wherein determining the junction temperature variation comprises estimating a peak junction temperature for one cycle of the output current waveform.

8. A method of operating an inverter module, comprising:

activating and deactivating a solid state switch at a switching frequency to generate an output current waveform, wherein the solid state switch is electrically coupled in parallel to a diode; and

varying the switching frequency based on a determined temperature variation of the solid state switch or the diode.

9. The method of claim 8, wherein varying the switching frequency comprises setting the switching frequency to a specified high frequency if the determined temperature variation is below a low temperature threshold, and setting the switching frequency to a specified low frequency if the determined temperature variation is above a high temperature threshold.

10. The method of claim 9, wherein the high temperature threshold is approximately 60 degrees Celsius and the low temperature threshold is approximately 55 degrees Celsius.

11. The method of claim 8, comprising generating an estimated temperature of the solid state switch.

12. The method of claim 11, wherein generating an estimated temperature of the solid state switch comprises estimating a power loss of the solid state switch.

13. The method of claim 8, comprising determining a temperature variation of the solid state switch.

14. The method of claim 13, wherein determining a temperature variation of the solid state switch comprises determining a thermal impedance between the solid state switch and a case to which the solid state switch is mounted.

15. The method of claim 13, wherein determining a temperature variation of the solid state switch comprises estimating a junction temperature variation for one cycle of the output current waveform.

16. A motor control system, comprising:

an inverter module comprising a solid state switch coupled to a case, the inverter module configured to generate an output current waveform; and

control circuitry coupled to the inverter module and configured to vary a switching frequency of the inverter module based on a determined junction temperature variation of the solid state switch.

17. The motor control system of claim 16, comprising junction temperature determination circuitry configured to determine the junction temperature of the solid state switch.

18. The motor control system of claim 17, wherein the junction temperature determination circuitry is configured to determine the junction temperature variation by estimating a power loss of the solid state switch.

19. The motor control system of claim 16, wherein the control circuitry is configured to vary the switching frequency of the inverter module based on the junction temperature variation of the solid state switch for one cycle of output current waveform.

20. The motor control system of claim 19, comprising junction temperature determination circuitry configured to determine the junction temperature variation of the solid state switch for one cycle of output current waveform.

21. The motor control system of claim 20, wherein the junction temperature determination circuitry is configured to factor the junction temperature variation by a thermal impedance between a junction of the solid state switch and the case.

22. The motor control system of claim 19, wherein the control circuitry is configured to increase the switching frequency of the inverter module if the junction temperature variation of the solid state switch is less than a specified low temperature and decrease the switching frequency of the inverter module if the junction temperature variation of the solid state switch is more than a specified high temperature

23. The motor control system of claim 22, wherein the specified high temperature is approximately 60 degrees Celsius and the specified low temperature is approximately 55 degrees Celsius.