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Probe card electrically connectable with a semiconductor wafer

  • US 8,149,008 B2
  • Filed: 07/16/2008
  • Issued: 04/03/2012
  • Est. Priority Date: 07/19/2007
  • Status: Expired due to Fees
First Claim
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1. A probe card that electrically connects, using a plurality of probes, a semiconductor wafer and a circuit structure for generating a signal to be output to the semiconductor wafer, each probe is made of a conductive material and is extensible and compressible by elastic force along a longitudinal direction thereof, the probe card comprising:

  • a probe head that holds the plurality of probes;

    a wiring board that has a wiring pattern corresponding to the circuit structure;

    a flat interposer that is stacked on the wiring board and relays wirings of the wiring board;

    a flat space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head;

    a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer,wherein the interposer comprisesa plurality of connection terminals, each of which is made of a conductive material and is extensible and compressible by elastic force along a longitudinal direction thereof; and

    a housing member that is made of a flat insulating material and includes a plurality of through holes to individually house the connection terminals, andboth ends of each of the connection terminals in the longitudinal direction are exposed from the housing member.

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