Liquid jet head, method for manufacturing liquid jet head, and method for forming structure for liquid jet head

• US 8,152,276 B2
• Filed: 01/22/2009
• Issued: 04/10/2012
• Est. Priority Date: 01/28/2008
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Murayama, Hiroyuki, Tagawa, Yoshinori, Takeuchi, Souta, Watanabe, Makoto, Watanabe, Keiji
• Primary Examiner(s): Do, An
• Application Number:
  US12/357,820
• Publication Number:
  US 20090191487A1
• Time in Patent Office: 1,174 Days
• Field of Search: 347/20, 347/40, 347/45, 347/47
• US Class Current: 347/47
• CPC Class Codes: B41J 2/14024 Assembling head parts
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating

Abstract

A liquid ejecting head includes a coating resin layer including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively; a substrate having energy generating elements for generating energy for ejecting liquid; and an adhesion improving layer provided between the coating resin layer and the substrate. The coating resin layer further includes a first resin material layer closest to the substrate and at least one second resin material layer, and the first resin material layer provides at least one stepped portion continuing from a periphery of the second resin material layer.

Claims

1. A liquid ejecting head comprising:

a coating resin layer including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively;

a substrate having energy generating elements for generating energy for ejecting the liquid; and

an adhesion improving layer provided between said coating resin layer and said substrate,

wherein said coating resin layer further includes a first resin material layer which is closest to said substrate and in which the flow paths are formed, and at least one second resin material layer in which the ejection outlets are formed, and said first resin material layer provides at least one stepped portion continuing from a periphery of said second resin material layer.

2. A liquid ejection head according to claim 1, wherein said stepped portion has a height from an interface between said adhesion improving layer and said coating resin layer to a surface of said stepped portion that is smaller than one half of a maximum thickness of said coating resin layer.

3. A liquid ejection head according to claim 1, wherein said second resin material layer has a corner portion in the form of a curved surface.

4. A liquid ejection head according to claim 1, wherein a corner portion of said first resin material layer is formed by crossing surfaces.

5. A liquid ejection head according to claim 1, wherein said second resin material layer is provided with a groove surrounding a flow path formation region constituted by the ejection outlets and the flow paths.

6. A liquid ejection head according to claim 5, wherein the groove includes an inner side having pits and projections.

7. A liquid ejection head according to claim 5, wherein the groove includes a flat inner side.

8. A liquid ejection head according to claim 5, further comprising a plurality of connecting portions connecting outer and inner sides of the groove.

9. A liquid ejecting head comprising:

an orifice plate including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively;

a substrate which is connected with said orifice plate and has energy generating elements for generating energy for ejecting the liquid; and

a stepped portion provided at an outer periphery of said orifice plate, wherein the outer periphery of said orifice plate has a thickness not more than one half of a maximum thickness of said orifice plate.