Dual color/dual function focal plane
First Claim
1. A dual function, dual color focal plane PSD sensor chip assembly, comprising:
- a position sensitive wavefront sensor array,a pixelized camera array made of semiconductor material,a signal processing chip,flip-chip interconnects on the signal processing chip, andwirebond pads on the signal processing chip to support electronics,wherein short wavelength infrared photons are absorbed by the position sensitive wavefront sensor array and long wavelength infrared photons are absorbed by the camera array, andwherein the position sensitive wavefront sensor array is configured to permit long wavelength infrared photons to pass through the position sensitive wavefront sensor array to be absorbed by the pixelized camera array.
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Accused Products
Abstract
A single focal plane integrated circuit hybrid replaces multiple focal plane circuits and associated off-focal plane signal processing electronics. A dual function, dual color focal plane PSD sensor chip assembly includes a PSD array, a traditional pixelized camera array, a signal processing chip, and flip-chip interconnects and wirebond pads to support electronics on the signal processing chip. The camera array is made of a material sensitive to wavelengths longer than the PSD array material is sensitive to. The PSD array is disposed in the same substrate as the camera array. The PSD array tracks object locations and directs the camera array to window and zoom while capturing images. Inherent registration of PSD cells to the pixelized camera array makes responsivity map testing and spatial calibration unnecessary. Reduction in power dissipation is achieved by powering on the camera array only when the PSD detects a change in scene.
31 Citations
15 Claims
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1. A dual function, dual color focal plane PSD sensor chip assembly, comprising:
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a position sensitive wavefront sensor array, a pixelized camera array made of semiconductor material, a signal processing chip, flip-chip interconnects on the signal processing chip, and wirebond pads on the signal processing chip to support electronics, wherein short wavelength infrared photons are absorbed by the position sensitive wavefront sensor array and long wavelength infrared photons are absorbed by the camera array, and wherein the position sensitive wavefront sensor array is configured to permit long wavelength infrared photons to pass through the position sensitive wavefront sensor array to be absorbed by the pixelized camera array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification