Solid element device and method for manufacturing the same

• US 8,154,047 B2
• Filed: 10/07/2010
• Issued: 04/10/2012
• Est. Priority Date: 03/10/2003
• Status: Active Grant

• Current Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Suehiro, Yoshinobu, Inoue, Mitsuhiro, Kato, Hideaki, Hadame, Kunihiro, Tohmon, Ryoichi, Wada, Satoshi, Ota, Koichi, Aida, Kazuya, Watanabe, Hiroki, Yamamoto, Yoshinori, Ohtsuka, Masaaki, Sawanobori, Naruhito
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): TAYLOR, EARL N
• Application Number:
  US12/923,788
• Publication Number:
  US 20110101399A1
• Time in Patent Office: 551 Days
• Field of Search: 257/100, 257/E23.118, 257/E23.125, 257/E33.059, 362/311.02, 362/311.05
• US Class Current: 257/100
• CPC Class Codes: C03B 23/20 Uniting glass pieces by fusing without substantial reshaping
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO₂—Nb₂O₅-based, B₂O₃—F-based, P₂O₅—F-based, P₂O₅—ZnO-based, SiO₂—B₂O₃—La₂O₃-based, and SiO₂—B₂O₃-based low melting glasses.

Claims

1. A solid element device, comprising:

a solid element;

an electric power receiving and supplying part for receiving electric power from and supplying the electric power to said solid element; and

an inorganic sealing material for sealing said solid element, said inorganic sealing material comprising a low melting glass selected from SiO₂—

Nb₂O₅-based, B₂O₃—

F-based, P₂O₅—

F-based, P₂O₅—

ZnO-based, SiO₂—

B₂O₃—

La₂O₃-based, and SiO₂—

B₂O₃-based low melting glasses,

wherein said electric power receiving and supplying part comprises an inorganic material substrate with an electrically conductive pattern formed thereon, and

wherein said inorganic material substrate seals said solid element with said inorganic sealing material.

2. The solid element device according to claim 1, wherein said electric power receiving and supplying part comprises a metal lead.

3. The solid element device according to claim 2, wherein said metal lead comprises a soft metal.

4. The solid element device according to claim 1,

wherein said inorganic material substrate has a coefficient of thermal expansion equivalent to that of said inorganic sealing material.

5. The solid element device according to claim 1, wherein said inorganic sealing material has a lower coefficient of thermal expansion than that of said inorganic material substrate.

6. The solid element device according to claim 4, wherein said inorganic material substrate seals said solid element based on a chemical reaction bonding with said inorganic sealing material.

7. The solid element device according to claim 1, wherein said inorganic sealing material comprises a surface subjected to coating treatment for rendering said surface resistant to moisture, acids or alkalis.

8. The solid element device according to claim 1, wherein said solid element comprises an optical element, and said inorganic sealing material comprises a transparent material.

9. The solid element device according to claim 8, wherein said optical element comprises a light emitting element.

10. The solid element device according to claim 8, wherein said optical element is sealed by said inorganic sealing material with a refractive index of 1.7 or more.

11. The solid element device according to claim 8, wherein said optical element comprises a light receiving element.

12. The solid element device according to claim 1, wherein said inorganic sealing material comprises a surface subjected to a coating treatment for reducing reflection at an interface of said inorganic sealing material and air.

13. The solid element device according to claim 1, wherein said inorganic sealing material comprises a surface overmolded with a resin.

14. A solid element device, comprising:

a solid element;

an electric power receiving and supplying part for receiving electric power from and supplying the electric power to said solid element; and

an inorganic sealing material for sealing said solid element, said inorganic sealing material comprising a low melting glass selected from SiO₂—

Nb₂O₅-based, B₂O₃—

F-based, P₂O₅—

F-based, P₂O₅—

ZnO-based, SiO₂—

B₂O₃—

La₂O₃-based, and SiO₂—

B₂O₃-based low melting glasses,

wherein said electric power receiving and supplying part comprises an inorganic material substrate with an electrically conductive pattern formed thereon, and

wherein said inorganic sealing material is bonded to the inorganic material substrate by hot pressing.