Flip chip semiconductor device and process of its manufacture
First Claim
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1. A semiconductor die having a depth of 50 micrometers or less, the semiconductor die comprising:
- a first via extending into the body of and through an entire depth of the die and spaced from a first edge of the die; and
a first via electrode disposed inside the via electrically connecting a power electrode disposed on a top surface of the die with another power electrode disposed directly on and extending along an entire coplanar bottom surface of the die, wherein the via is disposed outside the termination region of the die.
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Abstract
A semiconductor die and method of making it are provided. The die includes a first via extending through the entire thickness of the die and a first via electrode disposed inside the via electrically connecting an electrode at a top surface of the die with another electrode disposed at a bottom surface of the die.
40 Citations
15 Claims
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1. A semiconductor die having a depth of 50 micrometers or less, the semiconductor die comprising:
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a first via extending into the body of and through an entire depth of the die and spaced from a first edge of the die; and a first via electrode disposed inside the via electrically connecting a power electrode disposed on a top surface of the die with another power electrode disposed directly on and extending along an entire coplanar bottom surface of the die, wherein the via is disposed outside the termination region of the die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A vertical conduction power semiconductor device comprising:
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a semiconductor die; a first via extending into and through an entire depth of said die; and a first via electrode disposed inside said first via electrically connecting a power electrode disposed on a top surface of said die with another power electrode disposed directly on and extending along an entire coplanar bottom surface of said die, wherein said first via is disposed outside a termination region of said die. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification