Profiled contact
First Claim
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1. A semiconductor chip, comprising:
- an integrated circuit (IC) pad; and
a device electrically coupled to the IC pad;
wherein the IC pad is further electrically coupled to an electrical contact; and
wherein the electrical contact has;
a first surface configured to facilitate penetration of the electrical contact into a malleable contact on another semiconductor chip at a temperature below a melting point of the malleable contact, wherein the first surface is angled outward from a tip of the electrical contact toward the IC pad; and
a second surface configured to couple to the malleable contact and to prevent separation of the electrical contact from the malleable contact after penetration of the electrical contact into the malleable contact, wherein the second surface is nearer the IC pad than the first surface, and wherein the second surface is angled from an end of the first surface inward toward a center of the electrical contact and toward the IC pad.
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Abstract
A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.
302 Citations
15 Claims
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1. A semiconductor chip, comprising:
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an integrated circuit (IC) pad; and a device electrically coupled to the IC pad; wherein the IC pad is further electrically coupled to an electrical contact; and wherein the electrical contact has; a first surface configured to facilitate penetration of the electrical contact into a malleable contact on another semiconductor chip at a temperature below a melting point of the malleable contact, wherein the first surface is angled outward from a tip of the electrical contact toward the IC pad; and a second surface configured to couple to the malleable contact and to prevent separation of the electrical contact from the malleable contact after penetration of the electrical contact into the malleable contact, wherein the second surface is nearer the IC pad than the first surface, and wherein the second surface is angled from an end of the first surface inward toward a center of the electrical contact and toward the IC pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 15)
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10. An electrical contact of a semiconductor chip, comprising:
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means for facilitating penetration of the electrical contact into a malleable contact at a temperature below a melting point of the malleable contact, wherein the means for facilitating penetration includes a first surface that is angled outward from a tip of the means for facilitating penetration and toward the semiconductor chip; and means for ensuring a strong physical connection between the malleable contact and the electrical contact when the electrical contact is coupled to the malleable contact, wherein the means for ensuring a strong physical connection includes a second surface nearer the semiconductor chip than the first surface, and wherein the second surface is angled from an end of the first surface inward toward a center of the electrical contact. - View Dependent Claims (11)
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12. An electronic system, comprising:
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a first electronic chip having an integrated circuit (IC) pad thereon; and a second electronic chip bonded to the first electronic chip through an electric connection coupled to the IC pad; wherein the electrical connection comprises a post and a malleable metal; and wherein the post has; a first surface configured to facilitate penetration of the post into the malleable metal at a temperature below a liquidus temperature of the malleable metal, wherein the first surface is angled outward from a tip of the post and toward the IC pad; and a second surface configured to couple to the malleable metal and to prevent separation of the post from the malleable metal, wherein the second surface is nearer the IC pad than the first surface, and wherein the second surface is angled from an end of the first surface inward toward a center of the post and toward the IC pad. - View Dependent Claims (13, 14)
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Specification