×

Profiled contact

  • US 8,154,131 B2
  • Filed: 01/10/2006
  • Issued: 04/10/2012
  • Est. Priority Date: 06/14/2005
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor chip, comprising:

  • an integrated circuit (IC) pad; and

    a device electrically coupled to the IC pad;

    wherein the IC pad is further electrically coupled to an electrical contact; and

    wherein the electrical contact has;

    a first surface configured to facilitate penetration of the electrical contact into a malleable contact on another semiconductor chip at a temperature below a melting point of the malleable contact, wherein the first surface is angled outward from a tip of the electrical contact toward the IC pad; and

    a second surface configured to couple to the malleable contact and to prevent separation of the electrical contact from the malleable contact after penetration of the electrical contact into the malleable contact, wherein the second surface is nearer the IC pad than the first surface, and wherein the second surface is angled from an end of the first surface inward toward a center of the electrical contact and toward the IC pad.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×