Compact self-contained condition monitoring device
First Claim
1. A condition monitoring apparatus for securing onto and monitoring a device comprising:
- a signal processor configured to sample an X-axis start up vibration level input signal and a Y-axis start up vibration level input signal at the start up of the device being monitored;
sample an X-axis subsequent vibration level input signal and a Y-axis subsequent vibration level input signal at a subsequent time after the startup of the device being monitored;
sample a temperature sensor input signal at the subsequent time after the startup of the device being monitored; and
monitor the device based at least partly on the following;
(i) making an X-axis comparison between the X-axis start up vibration level input signal and the X-axis subsequent vibration level input signal;
(ii) making a Y-axis comparison between the Y-axis start up vibration level input signal and the Y-axis subsequent vibration level input signal;
(iii) making a temperature comparison between the temperature sensor input signal and a temperature threshold value signal;
(iv) annunciating a high vibration or temperature indication for a high vibration or temperature condition associated with the device if either the X-axis comparison, the Y-axis comparison or the temperature comparison exceeds a respective threshold value associated with the device for at least two successive samples, or annunciating a normal indication.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention provides a new and unique method and apparatus for monitoring a device, such as a pump. The device may also include a fan, compressor, turbine or other rotating or reciprocating piece of machinery. In one embodiment, the method features sensing in a first device both a start-up vibration at a start-up time after the first device is affixed to a second device to be monitored and a subsequent vibration level at a subsequent time after the start-up time, and providing both a start-up vibration level signal containing information about the start-up vibration level of the second device, and a subsequent vibration level signal containing information about the subsequent vibration level of the second device; and monitoring in the first device the condition of operation of the second device based on a comparison of the start-up vibration level signal in relation to the subsequent vibration level signal. The apparatus may take the form of one or more modules and/or chipset for performing the steps and functionality of the aforementioned method.
-
Citations
20 Claims
-
1. A condition monitoring apparatus for securing onto and monitoring a device comprising:
-
a signal processor configured to sample an X-axis start up vibration level input signal and a Y-axis start up vibration level input signal at the start up of the device being monitored; sample an X-axis subsequent vibration level input signal and a Y-axis subsequent vibration level input signal at a subsequent time after the startup of the device being monitored; sample a temperature sensor input signal at the subsequent time after the startup of the device being monitored; and monitor the device based at least partly on the following; (i) making an X-axis comparison between the X-axis start up vibration level input signal and the X-axis subsequent vibration level input signal; (ii) making a Y-axis comparison between the Y-axis start up vibration level input signal and the Y-axis subsequent vibration level input signal; (iii) making a temperature comparison between the temperature sensor input signal and a temperature threshold value signal; (iv) annunciating a high vibration or temperature indication for a high vibration or temperature condition associated with the device if either the X-axis comparison, the Y-axis comparison or the temperature comparison exceeds a respective threshold value associated with the device for at least two successive samples, or annunciating a normal indication. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method for monitoring a device comprising:
-
sampling with a signal processor an X-axis start up vibration level input signal and a Y-axis start up vibration level input signal at the start up of the device being monitored; sampling with the signal processor an X-axis subsequent vibration level input signal and a Y-axis subsequent vibration level input signal at a subsequent time after the startup of the device being monitored; sample with the signal processor a temperature sensor input signal at the subsequent time after the startup of the device being monitored; and monitoring the device based at least partly on the following; (i) making an X-axis comparison between the X-axis start up vibration level input signal and the X-axis subsequent vibration level input signal; (ii) making a Y-axis comparison between the Y-axis start up vibration level input signal and the Y-axis subsequent vibration level input signal; (iii) making a temperature comparison between the temperature sensor input signal and a temperature threshold value signal; (iv) annunciating a high vibration or temperature indication for a high vibration or temperature condition associated with the device if either the X-axis comparison, the Y-axis comparison or the temperature comparison exceeds a respective threshold value associated with the device for at least two successive samples, or annunciating a normal indication. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification