Integrated liquid to air conduction module

• US 8,157,001 B2
• Filed: 03/30/2007
• Issued: 04/17/2012
• Est. Priority Date: 03/30/2006
• Status: Active Grant

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Hom, James, Upadhya, Girish, Werner, Douglas E., Munch, Mark, Tsao, Paul, Conway, Bruce, Zhou, Peng, Brewer, Richard
• Primary Examiner(s): CIRIC, LJILJANA V
• Application Number:
  US11/731,484
• Publication Number:
  US 20070227708A1
• Time in Patent Office: 1,845 Days
• Field of Search: 165/80.2, 165/80.3, 165/80.4, 165/104.32, 165/104.33, 165/133, 165/165, 165/166, 165/167, 165/247, 165/299, 165/300
• US Class Current: 165/299
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control

Abstract

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

Claims

1. An integrated cooling system comprising:

a. a first layer having a first side for coupling to a heat source adjacent to a contact area,

wherein the first layer has a first port and a second port coupled to a fluid path adjacent to the contact area,

the fluid path has a heat-transfer area adjacent to a second layer which is greater than the contact area,

the fluid path is configured to provide a double-counter flow structure including a first segment coupled to a second segment, wherein the second segment is adjacent to the first segment and fluid flow through the first segment is in an opposite direction as fluid flow through the second segment, further wherein the double-counter flow structure is adjacent to at least one electronic device;

b. a plurality of fluid fins in the first layer fluid path substantially evenly spaced over the contact area;

c. the second layer sealed to the first layer, thereby defining the fluid path with an inlet and an outlet suitable for pumping the fluid, wherein the second layer is configured with one or more air channels;

d. a plurality of pin fins and folded fins coupled to a side opposing the first layer, wherein the air fins are within at least one of the one or more air channels;

e. an air-mover coupled to at least one of the one or more air channels;

f. the heat source comprising at least one electronic device;

g. a pump coupled to the fluid path; and

h. a programmable controller,

wherein the programmable controller has a means for measuring a temperature, is programmed to increase a fluid flow through the fluid path as a function of an increased temperature, and is programmed to increase an airflow from the air-mover as a function of an increased temperature.

2. A liquid cooling system for a laptop computer, the system comprising:

a. a first layer having a first side for coupling to a heat source in the laptop computer adjacent to a contact area,

wherein the first layer has a fluid path adjacent to the contact area, further wherein the fluid path is configured to provide a double-counter flow structure including a first segment coupled to a second segment, wherein the second segment is adjacent to the first segment and fluid flow through the first segment is in an opposite direction as fluid flow through the second segment;

b. a plurality of fluid fins in the first layer fluid path substantially evenly spaced over the contact area;

c. a second layer sealed to the first layer, thereby defining the fluid path with an inlet and an outlet suitable for inputting and outputting fluid, wherein the second layer is configured with one or more air channels; and

d. a plurality of air fins coupled to a side of the second layer sealed to the first layer, wherein the plurality of air fins are within at least one of the one or more air channels.

3. The system of claim 2 further comprising at least one an air-mover coupled to at least one of the one or more air channels.

4. The system of claim 3 further comprising a pump coupled to the fluid path.

5. The system of claim 4 further comprising a programmable controller coupled to the pump and to the at least one air mover, wherein the programmable controller has a means for measuring a temperature, is programmed to increase a fluid flow through the fluid path from the pump as a function of an increased temperature, and is programmed to increase an airflow from the at least one air-mover as a function of the increased temperature.

6. The system of claim 2 wherein the heat source comprises one or more electronic devices.

7. The system of claim 2 wherein the fluid path has a contact area with the second layer which is greater than the contact area of the first layer with the heat source.

8. The system of claim 2 further comprising a fluid reservoir coupled to the pump.

9. The system of claim 2 wherein the plurality of air fins are configured to control an airflow path and a rate of airflow within the airflow path.

10. An integrated cooling system comprising:

a. a first layer having a first side for coupling to a heat source adjacent to a contact area,

wherein the first layer has a fluid path adjacent to the contact area, further wherein the fluid path is configured to provide a double-counter flow structure including a first segment coupled to a second segment, wherein the second segment is adjacent to the first segment and fluid flow through the first segment is in an opposite direction as fluid flow through the second segment;

b. a plurality of fluid fins in the first layer fluid path substantially evenly spaced over the contact area;

c. a second layer sealed to the first layer, thereby forming an integrated unit within a single housing, wherein the second layer sealed to the first layer defines the fluid path with an inlet and an outlet suitable for inputting and outputting fluid, further wherein the second layer is configured with one or more air channels; and

d. a plurality of air fins coupled to a side of the second layer sealed to the first layer, wherein the plurality of air fins are within at least one of the one or more air channels.

11. The system of claim 10 further comprising at least one an air-mover coupled to at least one of the one or more air channels.

12. The system of claim 11 further comprising a pump coupled to the fluid path.

13. The system of claim 12 further comprising a programmable controller coupled to the pump and to the at least one air mover, wherein the programmable controller has a means for measuring a temperature, is programmed to increase a fluid flow through the fluid path from the pump as a function of an increased temperature, and is programmed to increase an airflow from the at least one air-mover as a function of the increased temperature.

14. The system of claim 10 wherein the heat source comprises one or more electronic devices.

15. The system of claim 10 wherein the fluid path has a contact area with the second layer which is greater than the contact area of the first layer with the heat source.

16. The system of claim 10 further comprising a fluid reservoir coupled to the pump.

17. The system of claim 10 wherein the plurality of air fins are configured to control an airflow path and a rate of airflow within the airflow path.