RFID tag package and tire assembly
First Claim
1. A tire and RFID tag assembly comprising:
- a tire having a tag mounting surface;
a tag package mounted to the tag mounting surface and comprising;
a carrier substrate having a die receiving surface and at least one interconnection tab mounted to the die receiving surface and at least partially composed of electrically conductive material;
an antenna having an end connected to the interconnection tab on the die receiving surface and an antenna segment extending outward from the carrier substrate;
an integrated circuit die mounted to the die receiving surface and having at least one electrical contact in contacting engagement with the interconnection tab;
wherein the antenna is a dipole antenna comprising first and second antenna members having inward ends connected to respective first and second interconnection tabs on the die receiving surface and outer antenna segments extending outward from the carrier substrate, and the integrated circuit die having electrical contact means in contacting engagement with the first and second interconnection tabs.
1 Assignment
0 Petitions
Accused Products
Abstract
A tire and RFID tag combine as an assembly to include a tire and a tag package mounted to a tire tag mounting surface. The tag package includes a carrier substrate having a die receiving surface and one or more interconnection tabs mounted to the die receiving surface. The tag package further includes a dipole antenna or other antenna configuration formed by first and second antenna members having inward ends connected to respective first and second interconnection tabs on the die receiving surface and outer antenna segments extending outward from the carrier substrate. An integrated circuit die mounts to the die receiving surface and has electrical contact(s) in contacting engagement with the interconnection tab(s). A cap member or, alternatively, a cylindrical encapsulating member, may be utilized for enclosing the integrated circuit die, the carrier substrate, and the inward ends of the first and second antenna members; the outer antenna segments of the first and second antenna members extending outward from the cap member or encapsulating member in operable position against respective portions of the tire tag mounting surface.
54 Citations
8 Claims
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1. A tire and RFID tag assembly comprising:
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a tire having a tag mounting surface; a tag package mounted to the tag mounting surface and comprising; a carrier substrate having a die receiving surface and at least one interconnection tab mounted to the die receiving surface and at least partially composed of electrically conductive material; an antenna having an end connected to the interconnection tab on the die receiving surface and an antenna segment extending outward from the carrier substrate; an integrated circuit die mounted to the die receiving surface and having at least one electrical contact in contacting engagement with the interconnection tab; wherein the antenna is a dipole antenna comprising first and second antenna members having inward ends connected to respective first and second interconnection tabs on the die receiving surface and outer antenna segments extending outward from the carrier substrate, and the integrated circuit die having electrical contact means in contacting engagement with the first and second interconnection tabs. - View Dependent Claims (2, 3)
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4. A tire and RFID tag assembly comprising:
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a tire having a tag mounting surface; a tag package mounted to the tag mounting surface and comprising; a carrier substrate having a die receiving surface and at least one interconnection tab mounted to the die receiving surface and at least partially composed of electrically conductive material; an antenna having an end connected to the interconnection tab on the die receiving surface and an antenna segment extending outward from the carrier substrate; an integrated circuit die mounted to the die receiving surface and having at least one electrical contact in contacting engagement with the interconnection tab; wherein the integrated circuit die includes at least one integrated circuit device; wherein the integrated circuit die is operably mounted substantially flat against the die receiving surface and the electrical contact of the integrated circuit die is operably positioned substantially flat against the interconnection tab; and wherein the antenna is a dipole antenna comprising first and second antenna members having inward ends connected to respective first and second interconnection tabs on the die receiving surface and outer antenna segments extending outward from the carrier substrate, and the integrated circuit die having at least first and second electrical contacts in contacting engagement with the first and second interconnection tabs. - View Dependent Claims (5, 6, 7, 8)
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Specification