Illumination device comprising a heat sink

• US 8,157,418 B2
• Filed: 11/04/2008
• Issued: 04/17/2012
• Est. Priority Date: 11/19/2007
• Status: Active Grant

• Current Assignee: Optotronic GmbH (Inventronics (Hangzhou), Inc.)
• Original Assignee: OSRAM Licht AG (Ams-Osram AG)
• Inventors: Kraus, Robert
• Primary Examiner(s): Neils, Peggy A.
• Application Number:
  US12/290,807
• Publication Number:
  US 20090129076A1
• Time in Patent Office: 1,260 Days
• Field of Search: 362/294, 362/373, 362/249.02, 362/249.04
• US Class Current: 362/294
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

The invention relates to an illumination device (1) comprising at least one substrate plate (2), at least two light-emitting diodes (3) (LEDs) arranged on the same side (A) of the substrate plate (2), and at least one electrically conductive cooling device (8) arranged on the opposite side (B) of the substrate plate (2), in particular a metallic heat sink (8), wherein at least two LEDs (3) are thermally operatively connected to the cooling device (8) by means of in each case at least one thermal coupling device (9) formed from an electrically conductive material. According to the invention, the cooling device (8) has at least two regions (8a, 8b, 8c) which are electrically isolated from one another, wherein a first region (8b) is thermally and electrically operatively connected to at least one first LED (3), and a second region (8a, 8c) is thermally and electrically operatively connected to at least one second LED (3).

Claims

1. An illumination device (1) comprising at least one substrate plate (2), at least two light-emitting diodes (3) (LEDs) arranged on the same side (A) of the substrate plate (2), the LEDs (3) are each embedded into a housing (6) placed on the substrate plate in order to dissipate waste heat of the LEDs (3), and at least one electrically conductive cooling device (8) arranged on the opposite side (B) of the substrate plate (2) wherein at least two LEDs (3) are thermally operatively connected to the cooling device (8) by means of in each case at least one thermal coupling device (9) formed from an electrically conductive material,

characterized in that the cooling device (8) has at least two regions (8a, 8b, 8c) which are electrically isolated from one another, wherein a first region (8b) is thermally and electrically operatively connected to at least one first LED (3), and a second region (8a, 8c) is thermally and electrically operatively connected to at least one second LED (3) and

characterized in that at least one mechanical connecting element (13) is arranged between at least two regions (8a, 8b, 8c) of the cooling device (8) while maintaining the at least two regions electrically isolated from one another.

2. The illumination device (1) as claimed in claim 1, characterized in that at least one region (8a, 8b, 8c) of the cooling device (8) and at least one device (9) for thermally coupling at least one LED (3) to the cooling device (8) are embodied in one piece.

3. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) is fitted to at least one of the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another, by means of a positively locking connection.

4. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) is fitted to at least one of the regions (8a, 9b, 8c) of the cooling device (8) which are electrically isolated from one another, by means of a force-locking connection.

5. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) is fitted to at least one of the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another, by means of an adhesive bonding connection (18).

6. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) has at least one section (14, 18) formed from a polymer material and serving for electrically insulating the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another.

7. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) has at least one section formed from a ceramic material, and serving for electrically insulating the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another.

8. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) has at least one section formed from a glass material and serving for electrically insulating the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another.

9. The illumination device (1) as claimed in claim 1, characterized in that the mechanical connecting element (13) has at least one section (18) formed from an adhesive (18) and serving for electrically insulating the regions (8a, 8b, 8c) of the cooling device (8) which are electrically isolated from one another, in particular is formed as an adhesive bonding connection (18).

10. The illumination device (1) as claimed in claim 1, characterized in that the side (B) of the substrate plate (2) which faces the cooling device (8) is covered substantially, in particular to more than 70%, by the cooling device (8).

11. The illumination device (1) as claimed in claim 1, characterized in that means (13, 18) for simply subdividing the substrate plate (2) into at least two regions (8a, 8b, 8c) which are electrically insulated from one another are provided.

12. The illumination device (1) as claimed in claim 1, characterized in that at least two LEDs (3) arranged on the illumination device (1) are thermally operatively connected to a common region (8a, 8b, 8c) of the cooling device (8).

13. The illumination device (1) as claimed in claim 1, characterized in that each of the LEDs (3) arranged on the illumination device (1) is respectively thermally operatively connected to a region (8a, 8b, 8c) of the cooling device (8) and all the regions (8a, 8b, 8c) of the cooling device (8) which are respectively operatively connected to an LED (3) are in each case electrically isolated from one another.

14. The illumination device (1) as claimed in claim 1, characterized in that the substrate plate (2) is embodied as a flexible substrate plate (2).

15. The illumination device (1) as claimed in claim 3, wherein the positively locking connection is at least one of a screw connection, a plug connection and a sliding connection.

16. The illumination, device (1) as claimed in claim 7, wherein the ceramic material is at least one of aluminum oxide, aluminum nitrite and zirconium oxide.

17. The illumination device (1) as claimed in claim 1, wherein the conductive cooling device is a metallic heat sink.

18. The illumination device (1) as claimed in claim 4, wherein the force locking connection is a clamping connection (19).