LED package having an array of light emitting cells coupled in series

• US 8,159,000 B2
• Filed: 06/14/2011
• Issued: 04/17/2012
• Est. Priority Date: 03/11/2005
• Status: Expired due to Fees

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Chung Hoon, Lee, Keon Young, Kim, Hong San, Kim, Dae Won, Choi, Hyuck Jung
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): TAYLOR, EARL N
• Application Number:
  US13/159,846
• Publication Number:
  US 20110241054A1
• Time in Patent Office: 308 Days
• Field of Search: 257/99, 257/100, 438/39, 438/42
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light-emitting diode package, comprising:

a heat sink;

a nitride semiconductor light-emitting chip arranged on a top side of the heat sink, a first surface of the nitride semiconductor light-emitting chip comprising a first type nitride semiconductor layer, a semi-insulating layer, or an insulating nitride semiconductor layer, a second surface of the nitride semiconductor light-emitting chip comprising a second type nitride semiconductor layer and a concave cut-out region, the first type nitride semiconductor layer being exposed in the concave region;

a package body coupled with the heat sink, a bottom side of the heat sink not being covered by the package body;

a lead frame coupled with the package body, the lead frame being spaced apart from the heat sink and protruding from the package body;

a substrate arranged between the heat sink and the nitride semiconductor light-emitting chip;

a passivation layer arranged between the substrate and the nitride semiconductor light-emitting chip;

a plurality of electrode patterns arranged between the substrate and the nitride semiconductor light-emitting chip; and

a bonding pad arranged at an edge of the substrate,

wherein the bottom side of the heat sink and a portion of the lead frame are coplanar, and

wherein inner walls of the package body comprise a stepped portion.

2. The light-emitting diode package of claim 1, wherein the electrode patterns connect the bonding pad to the nitride semiconductor light-emitting chip.

3. The light-emitting diode package of claim 1, further comprising a molding member arranged on the nitride semiconductor light emitting chip.

4. The light-emitting diode package of claim 3, wherein the molding member comprises a phosphor.

5. The light-emitting diode package of claim 1, further comprising a lens arranged on the stepped portion.

6. The light-emitting diode package of claim 1, wherein the lead frame comprises a first lead frame electrically connected to the first type nitride semiconductor layer and a second lead frame electrically connected to the second type nitride semiconductor layer.