Package for an electronic device
First Claim
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1. A device formed by a process comprising:
- providing a substrate having a component;
forming a sacrificial layer over the component, the sacrificial layer including a cavity portion at least partially surrounding the component and a tunnel portion adjacent the cavity portion;
forming an encapsulation layer having a cover portion and a perimeter portion over the sacrificial layer, wherein the cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion and the perimeter portion is disposed over the tunnel portion; and
forming an access hole in the perimeter portion of the encapsulation layer, wherein the tunnel portion is formed from a different material than the cavity portion.
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Accused Products
Abstract
A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.
53 Citations
22 Claims
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1. A device formed by a process comprising:
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providing a substrate having a component; forming a sacrificial layer over the component, the sacrificial layer including a cavity portion at least partially surrounding the component and a tunnel portion adjacent the cavity portion; forming an encapsulation layer having a cover portion and a perimeter portion over the sacrificial layer, wherein the cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion and the perimeter portion is disposed over the tunnel portion; and forming an access hole in the perimeter portion of the encapsulation layer, wherein the tunnel portion is formed from a different material than the cavity portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A device comprising:
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a substrate having a component positioned thereon; an encapsulation layer having a generally planar perimeter portion surrounding a raised, generally trapazoidally-shaped cover portion, the cover portion defining a cavity that surrounds the component, the perimeter portion defining a tunnel portion underneath the perimeter portion and fluidly connected to the cavity; and an access hole in the perimeter portion of the encapsulation layer wherein the tunnel portion is formed from a different material than the cover portion. - View Dependent Claims (19, 20, 21, 22)
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Specification