Holding member for inspection, inspection device and inspecting method

• US 8,159,245 B2
• Filed: 10/17/2007
• Issued: 04/17/2012
• Est. Priority Date: 10/17/2006
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Komatsu, Shigekazu, Miyazono, Mitsuyoshi, Asaoka, Kazuya
• Primary Examiner(s): Rodas, Richard Isla
• Application Number:
  US12/444,695
• Publication Number:
  US 20100033199A1
• Time in Patent Office: 1,644 Days
• Field of Search: 324/754.08, 324/754.1
• US Class Current: 324/754.01
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808

Abstract

Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.

Claims

1. An inspection device for inspecting electrical characteristics of a power device having terminals on its top surface and bottom surface, the inspection device comprising:

a support plate for mounting thereon a chip in which the power device is formed;

a positioning member for positioning the chip mounted on the support plate;

a metal film formed on a surface of the support plate in a range from an area on which the chip is mounted to an area on which the chip is not mounted;

a probe pin configured to be brought into contact with the metal film in the area on which the chip is not mounted; and

a fritting probe pin making a pair with the probe pin, which is in contact with the metal film together with the probe pin and electrically conducts the probe pin to the metal film by utilizing a fitting phenomenon,

wherein the metal film in the area on which the chip is not mounted makes it possible to electrically conduct the probe pin with the terminal on the bottom surface of the power device when the probe pin is brought into contact with the metal film in the area on which the chip is not mounted.

2. The inspection device of claim 1, wherein the positioning member is a plurality of pins or protrusions in contact with a side surface of the chip.

3. The inspection device of claim 1, wherein the positioning member is a recessed portion capable of accommodating the chip and is formed on the surface of the support plate, and

the metal film is formed in a range from a bottom surface of the recessed portion to an outer peripheral surface of an outside of the recessed portion.

4. The inspection device of claim 1, wherein the positioning member is a recessed portion capable of accommodating the chip and is formed on a surface of the metal film.

5. The inspection device of claim 1, further comprising:

another metal film insulated from the metal film and formed on the surface of the support plate in a range from an area on which the chip is mounted to an area on which the chip is not mounted.

6. The inspection device of claim 1, wherein at least one suction opening for sucking and holding the chip is formed in the area on which the chip is mounted on the surface the support plate.

7. The inspection device of claim 6, wherein the at least one suction opening is plural in number, and

each of the at least one suction opening communicates with a common opening portion opened at a rear surface of the support plate.

8. The inspection device of claim 1, wherein the support plate mounts thereon a plurality of chips, and

the positioning member and the metal film are formed for each chip.

9. An inspection device for inspecting electrical characteristics of a power device, including a holding member for inspection for holding the power device when inspecting the electrical characteristics of the power device having terminals on its top surface and bottom surface, the inspection device comprising:

a top surface terminal probe pin which is in contact with a top surface of a chip held onto the holding member for inspection, and is electrically conducted with the terminal on the top surface of the power device;

a bottom surface terminal probe pin which is in contact with a metal film in an area on which the chip on the holding member for inspection is not mounted, and is electrically conducted with the terminal on the bottom surface of the power device;

a top surface terminal fritting probe pin making a pair with the top surface terminal probe pin, which is in contact with the terminal on the top surface of the power device together with the top surface terminal probe pin and electrically conducts the top surface terminal probe pin to the terminal on the top surface by utilizing a fritting phenomenon; and

a bottom surface terminal fritting probe pin making a pair with the bottom surface terminal probe pin, which is in contact with the metal film together with the bottom surface terminal probe pin and electrically conducts the bottom surface terminal probe pin to the metal film by utilizing a fritting phenomenon,

wherein the holding member for inspection includes;

a support plate for mounting thereon the chip in which the power device is formed;

a positioning member for positioning the chip mounted on the support plate; and

the metal film formed on a surface of the support plate in a range from an area on which the chip is mounted to the area on which the chip is not mounted.

10. An inspecting method for inspecting electrical characteristics of a power device by using an inspection device, wherein the inspection device inspects the electrical characteristics of the power device and includes a holding member for inspection for holding the power device when inspecting the electrical characteristics of the power device having terminals on its top surface and bottom surface, the inspection device comprising:

a top surface terminal probe pin which is in contact with a top surface of a chip held onto the holding member for inspection, and is electrically conducted with the terminal on the top surface of the power device; and

a bottom surface terminal probe pin which is in contact with a metal film in an area on which the chip on the holding member for inspection is not mounted, and is electrically conducted with the terminal on the bottom surface of the power device,

wherein the holding member for inspection includes;

a support plate for mounting thereon the chip in which the power device is formed;

a positioning member for positioning the chip mounted on the support plate; and

the metal film formed on a surface of the support plate in a range from an area on which the chip is mounted to the area on which the chip is not mounted,

wherein the inspecting method brings, from a top surface side of the holding member for inspection, the top surface terminal probe pin into contact with the top surface of the chip on the holding member for inspection;

brings the bottom surface terminal probe pin into contact with the metal film;

applies a voltage to the terminals on the top surface and the bottom surface of the power device; and

inspects the electrical characteristics,

a top surface terminal fritting probe pin is brought into contact with the terminal on the top surface of the power device together with the top surface terminal probe pin and the top surface terminal probe pin is electrically conducted with the terminal on the top surface by utilizing a fritting phenomenon, and

a bottom surface terminal fritting probe pin is brought into contact with the metal film together with the bottom surface terminal probe pin and the bottom surface terminal probe pin is electrically conducted with the metal film by utilizing a fritting phenomenon.