Strain and displacement sensor and system and method for using the same

• US 8,161,823 B2
• Filed: 10/27/2009
• Issued: 04/24/2012
• Est. Priority Date: 10/28/2008
• Status: Active Grant

• Current Assignee: Pile Dynamics, Inc.
• Original Assignee: Pile Dynamics, Inc.
• Inventors: Berris, Richard E. Jr.
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): Davis-Hollington, Octavia
• Application Number:
  US12/606,367
• Publication Number:
  US 20100101329A1
• Time in Patent Office: 910 Days
• Field of Search: 737/80
• US Class Current: 73/780
• CPC Class Codes: G01B 7/22 using change in capacitance
• CPC Class Codes: G01L 1/142 using capacitors
• CPC Class Codes: G01L 1/144 with associated circuitry G01L1/146 and G01L1/148 take precedence

Abstract

A capacitively-coupled strain sensor and methods are presented in which the strain on a structure is measured by the varying capacitance created by the displacement of one or more boards attached to the structure.

Claims

1. A sensor for detecting displacement in an associated structure, the sensor comprising:

a first board having a first substrate with an inwardly facing surface extending in a displacement direction between a first end and a second end (204), the first board having a first portion including;

a first electrically conductive coupling capacitor pad on the inward surface of the first board and coupled with a first input,

a second electrically conductive coupling capacitor pad on the inward surface of the first board and coupled with a second input, and

a first electrically conductive bridge capacitor pad on the inward surface of the first board and coupled with a first output;

a second board having a second substrate with an inwardly facing surface extending in the displacement direction between a first end and a second end, the second board being spaced from the first board with the inwardly facing surfaces of the boards facing one another and forming a gap therebetween, the second board including a first portion including;

a third electrically conductive coupling capacitor pad on the inward surface of the second board, at least a portion of the third coupling capacitor pad facing at least a portion of the second coupling capacitor pad of the first board to form a second (CC2) coupling capacitor via a dielectric in the gap between the boards,

a fourth electrically conductive coupling capacitor pad on the inward surface of the second board, at least a portion of the fourth coupling capacitor pad facing at least a portion of the first coupling capacitor pad of the first board to form a first (CC1) coupling capacitor via the dielectric in the gap between the boards,

a second electrically conductive bridge capacitor pad on the inward surface of the second board and coupled with one of the third and fourth coupling capacitor pads, at least a portion of the second bridge capacitor pad facing at least a first portion of the first bridge capacitor pad of the first board to form a first bridge capacitor via the dielectric in the gap between the boards, and

a third electrically conductive bridge capacitor pad on the inward surface of the second board and coupled with the other one of the third and fourth coupling capacitor pads, at least a first portion of the third bridge capacitor pad facing at least a second portion of the first bridge capacitor pad of the first board to form a second bridge capacitor via the dielectric in the gap between the boards;

at least one mounting structure supporting the first and second boards relative to one another with one of the first portions of the first and second boards being displaceable relative to the other first portion throughout a displacement range in the displacement direction such that capacitances of the first and second bridge capacitors vary as the first portions of the first and second boards are displaced relative to one another throughout at least a portion of a displacement range in the displacement direction.

2. The sensor of claim 1:

wherein the first board further comprises a fourth electrically conductive bridge capacitor pad on the inward surface of the first board and coupled with a second output, at least a first portion of the fourth bridge capacitor pad facing at least a second portion of the third bridge capacitor pad of the second board to form a third bridge capacitor via the dielectric in the gap between the boards;

wherein the second board further comprises a fifth electrically conductive bridge capacitor pad on the inward surface of the second board and coupled with the one of the third and fourth coupling capacitor pads, at least a portion of the fifth bridge capacitor pad facing at least a second portion of the fourth bridge capacitor pad of the first board to form a fourth bridge capacitor via the dielectric in the gap between the boards; and

wherein the at least one mounting structure supports the first and second boards relative to one another with one of the first portions of the first and second boards being displaceable relative to the other first portion throughout the displacement range in the displacement direction such that capacitances of the first, second, third, and fourth bridge capacitors vary as the first portions of the first and second boards are displaced relative to one another throughout at least a portion of a displacement range in the displacement direction.

3. The sensor of claim 2, where the first and second coupling capacitors remain constant as the first portions of the first and second boards are displaced relative to one another throughout at least a portion of the displacement range in the displacement direction.

4. The sensor of claim 2, wherein the dielectric in the gap between the boards is air.

5. The sensor of claim 2, further comprising a dielectric material disposed between the first and second boards.

6. The sensor of claim 5, the sensor of claim 5, wherein the dielectric material is formed on one of the inwardly facing surfaces of the first and second boards.

7. The sensor of claim 2, wherein the second board includes no external electrical connections.

8. The sensor of claim 2, wherein the first and second boards have no electrically conductive connections therebetween.

9. The sensor of claim 2, wherein at least one of the first and second boards includes a spring portion, a fixed portion on one side of the spring portion and a displacement portion on the other side of the spring portion, the fixed portion be fixed relative to the other board and the displacement portion being displaceable in the displacement direction relative to the other board.

10. The sensor of claim 1, where the first and second coupling capacitors remain constant as the first portions of the first and second boards are displaced relative to one another throughout at least a portion of the displacement range in the displacement direction.

11. The sensor of claim 1, wherein the dielectric in the gap between the boards is air.

12. The sensor of claim 1, further comprising a dielectric material disposed between the first and second boards.

13. The sensor of claim 12, wherein the dielectric material is formed on one of the inwardly facing surfaces of the first and second boards.

14. The sensor of claim 1, wherein the second board includes no external electrical connections.

15. The sensor of claim 1, wherein the first and second boards have no electrically conductive connections therebetween.

16. The sensor of claim 1, wherein at least one of the first and second boards includes a spring portion, a fixed portion on one side of the spring portion and a displacement portion on the other side of the spring portion, the fixed portion be fixed relative to the other board and the displacement portion being displaceable in the displacement direction relative to the other board.

17. A system of monitoring the displacement or strain of a structure, the system comprising the sensor of claim 1, the system further including a communication device.

18. The system according to claim 17 wherein in the communication device includes a transceiver.

19. The system according to claim 17 wherein the system includes a plurality of sensors.