LED chip package structure with multifunctional integrated chips and a method for making the same

• US 8,162,510 B2
• Filed: 09/29/2008
• Issued: 04/24/2012
• Est. Priority Date: 02/22/2008
• Status: Active Grant

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Wu, Shih-Yu, Wu, Wen-Kuei
• Primary Examiner(s): Toledo, Fernando L
• Assistant Examiner(s): Dulka, John P
• Application Number:
  US12/285,027
• Publication Number:
  US 20090212304A1
• Time in Patent Office: 1,303 Days
• Field of Search: 362/276, 362/800
• US Class Current: 362/276
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.

Claims

1. A LED chip package structure, comprising:

an opaque substrate unit;

a light-emitting unit having a plurality of LED chips electrically connected to and arranged on the opaque substrate unit;

a multifunctional integrated chip unit electrically connected to and arranged on the opaque substrate unit, wherein the multifunctional integrated chip unit is arranged between the light-emitting unit and a power source, and the multifunctional integrated chip unit simultaneously corresponds to all of the LED chips of the light-emitting unit;

a package colloid unit having a plurality of fluorescent colloid bodies for respectively covering the LED chips, wherein each fluorescent colloid body has a colloid cambered surface and a colloid light-exiting surface respectively formed on a top surface and a front surface thereof, and the colloid cambered surface is extended upwardly and forwardly from a top surface of the opaque substrate unit and the colloid light-exiting surface is extended downwardly from a top end of the colloid cambered surface to the top surface of the opaque substrate unit; and

a frame unit having an opaque frame layer formed on the opaque substrate unit to cover the fluorescent colloid bodies, wherein all of outer surfaces of each fluorescent colloid body are covered by each opaque frame layer except the colloid light-exiting surface of each fluorescent colloid body.

2. A LED chip package structure, comprising:

an opaque substrate unit;

a light-emitting unit having a plurality of LED chips electrically connected to and arranged on the opaque substrate unit;

a multifunctional integrated chip unit electrically connected to and arranged on the opaque substrate unit, wherein the multifunctional integrated chip unit is arranged between the light-emitting unit and a power source, and the multifunctional integrated chip unit simultaneously corresponds to all of the LED chips of the light-emitting unit;

a package colloid unit having a plurality of fluorescent colloid bodies for respectively covering the LED chips, wherein each fluorescent colloid body has a colloid cambered surface and a colloid light-exiting surface respectively formed on a top surface and a front surface thereof, and the colloid cambered surface is extended upwardly and forwardly from a top surface of the opaque substrate unit and the colloid light-exiting surface is extended downwardly from a top end of the colloid cambered surface to the top surface of the opaque substrate unit; and

a frame unit having a plurality of opaque frame layers formed on the opaque substrate unit to respectively cover the fluorescent colloid bodies, and the opaque frame layers being separated from each other, wherein all of outer surfaces of each fluorescent colloid body are covered by each opaque frame layer except the colloid light-exiting surface of each fluorescent colloid body.