Method for joining implants

• US 8,162,977 B2
• Filed: 10/31/2007
• Issued: 04/24/2012
• Est. Priority Date: 08/27/2002
• Status: Active Grant

• Current Assignee: P TECH, LLC
• Original Assignee: P TECH, LLC
• Inventors: Bonutti, Peter M., Cremens, Matthew J.
• Primary Examiner(s): WOO, JULIAN W
• Application Number:
  US11/932,602
• Publication Number:
  US 20080108897A1
• Time in Patent Office: 1,637 Days
• Field of Search: 606/113, 606/232, 606/300, 606/151
• US Class Current: 606/232
• CPC Class Codes: A61B 17/0487 Suture clamps, clips or locks, e.g. for replacing suture knots; Instruments for applying or removing suture clamps, clips or locks suture anchors A61B17/0401; wound clamps or clips A61B17/08; ligaturing clamps or clips A61B17/122
• CPC Class Codes: A61B 2017/045 snug fit within the anchor
• CPC Class Codes: A61B 2017/0459 Multiple holes in the anchor through which the suture extends and locking the suture when tension is applied
• CPC Class Codes: A61B 2017/0464 for soft tissue
• CPC Class Codes: A61B 2017/0488 Instruments for applying suture clamps, clips or locks for applying suture anchors A61B2017/0409; for applying wound clamps A61B17/10; for applying ligaturing clamps or clips A61B17/128
• CPC Class Codes: A61B 2017/0619 thermoplastic, e.g. for bonding, welding, fusing or cutting the suture by melting it suture cutters A61B17/0467; ultrasonic cutters A61B17/320068; electrically heated instruments A61B18/08
• CPC Class Codes: Y10T 24/39 Cord and rope holders

Abstract

The present invention provides a method of securing a suture. The method includes providing a retainer having first and second sections. The first section has a central post, and the second section has a central bore dimensioned to receive the central post. The method also includes moving a suture through a passage in the first section, wrapping the suture around the central post, and moving the suture through a channel of the second section. The method further includes interconnecting the first and second sections with the central post positioned in the central bore and with the suture disposed between the first and second sections. Moreover, the method includes bonding the first and second sections together to secure the suture relative to the retainer.

Claims

1. A method for joining a first implant and a second implant, the method comprising:

positioning the first implant into a body of a patient, the first implant having an upper surface with at least one recess or a plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;

positioning the second implant into the body of the patient, the second implant having a lower surface with a projection and wherein at least the projection of the second implant is configured to contact at least a portion of the upper surface of the first implant;

applying ultrasonic energy to the second implant to soften at least a portion of the projection or the surface feature at or near a joining region; and

applying a force to the second implant such that at least a portion of the first or second implant deforms to join the first and second implants at or near the joining region.

2. The method of claim 1 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.

3. The method of claim 1 wherein the at least a portion of the projection or the surface feature is heated into or above its transition temperature range.

4. The method of claim 1 wherein the application of the force is initiated during the application of the ultrasonic energy.

5. The method of claim 1 wherein the application of the force is continued after the application of the ultrasonic energy.

6. The method of claim 1 wherein at least a portion of the projection or the surface feature flows after application of the force is initiated.

7. The method of claim 1 wherein the first implant includes a groove or a second recess.

8. A method for joining a first implant and a second implant, the method comprising:

providing a first implant having an upper surface with a recess or plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;

providing a second implant having a lower surface with a projection, wherein at least a portion of the second implant is configured to contact at least a portion of the recess or plurality of pores of the upper surface of the first implant;

applying ultrasonic energy to the second implant to soften at least a portion of the projection or the surface feature; and

applying a force to the second implant such that at least a portion of the projection or the surface feature deforms to join the first and second implants.

9. The method of claim 8 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.

10. The method of claim 8 wherein the application of the force is initiated during the application of the ultrasonic energy.

11. The method of claim 8 wherein the application of the force is continued after the application of the ultrasonic energy.

12. The method of claim 8 wherein at least a portion of the projection or the surface feature flows after application of the force is initiated.

13. The method of claim 8 wherein the first implant includes a groove or a second recess.

14. The method of claim 8 wherein at least a portion of the projection or the surface feature is heated into or above its transition temperature range.

15. A method for joining a first implant and a second implant, the method comprising:

passing the first implant into a body of a patient, the first implant having an upper surface with at least one recess or a plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;

passing the second implant into the body of the patient, the second implant having a lower surface with a projection, and wherein the projection of the second implant is configured to contact at least a portion of the recess or plurality of pores of the first implant;

applying ultrasonic energy to the second implant to thereby soften at least a portion of the projection or the surface feature at or near a joining region; and

applying a force to the second implant such that the projection or the surface feature deforms to join the first and second implants at or near the joining region.

16. The method of claim 15 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.

17. The method of claim 15 wherein the application of the force is initiated during the application of the ultrasonic energy.

18. The method of claim 15 wherein the application of the force is continued after the application of the ultrasonic energy.

19. The method of claim 15 wherein the material of the projection or the surface feature flows after application of the force is initiated.

20. The method of claim 15 wherein the first implant includes a groove or a second recess.