Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof

• US 8,163,647 B2
• Filed: 07/08/2009
• Issued: 04/24/2012
• Est. Priority Date: 03/20/2003
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kawabata, Akio, Nihei, Mizuhisa
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): Perkins, Pamela E
• Application Number:
  US12/458,308
• Publication Number:
  US 20090269921A1
• Time in Patent Office: 1,021 Days
• Field of Search: None
• US Class Current: 438/652
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C23C 16/26 Deposition of carbon only
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 21/76879 by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating plating on semiconductors in general H01L21/288
• CPC Class Codes: H01L 2221/1094 Conducting structures comprising nanotubes or nanowires
• CPC Class Codes: H05K 3/4076 by thin-film techniques

Abstract

An electronic device having a structure of an ohmic connection to a carbon element cylindrical structure body, wherein a metal material is positioned inside the junction part of a carbon element cylindrical structure body joined to a connection objective and the carbon element cylindrical structure body and the connection objective are connected by an ohmic contact. Methods for producing such an electronic device are also disclosed. Further, a method for growing a carbon nanotube is disclosed.

Claims

1. A method for producing an electronic device having a structure of ohmic connection to a carbon element cylindrical structure body, comprising disposing a metal material on a connection objective capable of ohmically contacting a carbon element cylindrical structure body and forming a carbon element cylindrical structure body by chemical vapor deposition using said metal material as the catalyst while accomplishing an ohmic contact between the carbon element cylindrical structure body and the connection objective,

wherein the material of said connection objective is Ti, Nb, Si or C, and is alloyed with said metal material by the elevation of temperature during said chemical vapor deposition and a carbon element cylindrical structure body is grown using the particle of said metal material in said alloy as the catalyst for said chemical vapor deposition, and, at the same time, a part of the material of the connection objective is carbidized to join the carbon element cylindrical structural body to the connection objective by ohmic contact.

2. The method for producing an electronic device as claimed in claim 1, wherein said metal material is Ni, Fe or Co, or an alloy containing at least one of Ni, Fe and Co.

3. The method for producing an electronic device as claimed in claim 1, wherein said chemical vapor deposition is performed by applying an electric field in the growth direction of the carbon element cylindrical structure body.

4. The method for producing an electronic device as claimed in claim 1, wherein said carbon element cylindrical structure body is a carbon nanotube.

5. A method for producing an electronic device having a structure of ohmic connection to a carbon element cylindrical structure body, comprising forming a first stack of a first material capable of ohmically contacting a carbon element cylindrical structure body and a second material of catalyst metal disposed on said first material, heat-treating said first stack in vacuum or in a hydrogen atmosphere to form a second stack made of a lower layer composed of an alloy of the first material and the second material, an intermediate layer composed of the first material and an upper layer composed of a fine particle of the second material, and forming a carbon element cylindrical structure body by chemical vapor deposition using the fine particle of the second material on the surface of said second stack as the catalyst to incorporate the fine particle of the second material into the inside of the carbon element cylindrical structure body and at the same time, a part of the first material in the intermediate layer contacting with the bottom of the side wall of the carbon element cylindrical structure is carbidized to join the carbon element cylindrical structure and the Ti intermediate layer by ohmic contact.

6. The method for producing an electronic device as claimed in claim 5, wherein said first material is Ti, Nb, Si or C.

7. The method for producing an electronic device as claimed in claim 5, wherein said second material is Ni, Fe or Co, or an alloy containing at least one of Ni, Fe and Co.

8. The method for producing an electronic device as claimed in claim 5, wherein said chemical vapor deposition is performed by applying an electric field in the growth direction of the carbon element cylindrical structure body.

9. The method for producing an electronic device as claimed in claim 5, wherein said carbon element cylindrical body is a carbon nanotube.