RF-biased capacitively-coupled electrostatic (RFB-CCE) probe arrangement for characterizing a film in a plasma processing chamber
First Claim
1. A method for characterizing a deposited film on a substrate within a processing chamber of a plasma processing system during substrate processing, comprising:
- determining a voltage-current characteristic for a probe head, wherein a measuring capacitor is set at a first capacitance value;
applying a radio frequency (RF) train to said probe head, thereby causing said measuring capacitor to be charged, wherein said measuring capacitor is set at a second capacitance value, said second capacitance value being greater than said first capacitance value;
providing an initial resistance value for said deposited film and an initial capacitance value for said deposited film;
employing said initial resistance value, said initial capacitance value, and said voltage-current characteristic to generate a first simulated voltage-time curve;
determining a first measured voltage-time curve, said first measured voltage-time curve representing a potential drop across said deposited film for one RF train; and
comparing said first simulated voltage-time curve to said first measured voltage-time curve, wherein if a difference between said first simulated voltage-time curve and said first measured voltage-time curve is less than a predefined threshold, employing said initial resistance value and said initial capacitance for characterizing said deposited film.
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Abstract
A method for characterizing deposited film on a substrate within a processing chamber during processing is provided. The method includes determining voltage-current characteristic for a probe head when measuring capacitor is set at a first capacitance value. The method also includes applying RF train to the probe head when measuring capacitor is set at a capacitance value greater than first capacitance value. The method further includes providing an initial resistance value and an initial capacitance value for the deposited film. The method yet also includes employing initial resistance value, initial capacitance value, and voltage-current characteristic to generate simulated voltage-time curve. The method yet further includes determining measured voltage-time curve, which represents potential drop across the deposited film for one RF train. The method more over includes comparing the two curves. If the difference is less than predefined threshold, employ initial resistance value and initial capacitance for characterizing the deposited film.
52 Citations
20 Claims
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1. A method for characterizing a deposited film on a substrate within a processing chamber of a plasma processing system during substrate processing, comprising:
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determining a voltage-current characteristic for a probe head, wherein a measuring capacitor is set at a first capacitance value; applying a radio frequency (RF) train to said probe head, thereby causing said measuring capacitor to be charged, wherein said measuring capacitor is set at a second capacitance value, said second capacitance value being greater than said first capacitance value; providing an initial resistance value for said deposited film and an initial capacitance value for said deposited film; employing said initial resistance value, said initial capacitance value, and said voltage-current characteristic to generate a first simulated voltage-time curve; determining a first measured voltage-time curve, said first measured voltage-time curve representing a potential drop across said deposited film for one RF train; and comparing said first simulated voltage-time curve to said first measured voltage-time curve, wherein if a difference between said first simulated voltage-time curve and said first measured voltage-time curve is less than a predefined threshold, employing said initial resistance value and said initial capacitance for characterizing said deposited film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An article of manufacture comprising a program storage medium having computer readable code embodied therein, said computer readable code being configured for characterizing a deposited film on a substrate within a processing chamber of a plasma processing system during substrate processing, comprising:
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code for determining a voltage-current characteristic for a probe head, wherein a measuring capacitor is set at a first capacitance value; code for applying a radio frequency (RF) train to said probe head, thereby causing said measuring capacitor to be charged, wherein said measuring capacitor is set at a second capacitance value, said second capacitance value being greater than said first capacitance value; code for providing an initial resistance value for said deposited film and an initial capacitance value for said deposited film; code for employing said initial resistance value, said initial capacitance value, and said voltage-current characteristic to generate a first simulated voltage-time curve; code for determining a first measured voltage-time curve, said first measured voltage-time curve representing a potential drop across said deposited film for one RF train; and code for comparing said first simulated voltage-time curve to said first measured voltage-time curve, wherein if a difference between said first simulated voltage-time curve and said first measured voltage-time curve is less than a predefined threshold, code for employing said initial resistance value and said initial capacitance for characterizing said deposited film. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. An arrangement for characterizing a deposited film within a processing chamber of a plasma processing system during substrate processing, comprising:
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a probe arrangement, wherein said probe arrangement is configured for at least measuring one plasma processing parameter, said probe arrangement including a plasma-facing sensor made of a conductive material, and a measuring capacitor configured to be switched between two or more values, wherein said plasma-facing sensor is coupled to a first plate of said measuring capacitor; a radio frequency (RF) voltage source, said RF voltage source being coupled to a second plate of said measuring capacitor, wherein said RF voltage source is configured to provide RF oscillation trains to said plasma-facing sensor; a resistor-capacitor circuit, wherein said resistor-capacitor circuit includes a resistor in parallel with a capacitor; a current measurement device, said current measurement device being disposed in series between said measuring capacitor and said RF voltage source, wherein said current measurement device is configured to detect said measuring capacitor current discharge rate; a voltage measurement device disposed between said first plate of said measuring capacitor and ground, wherein said voltage measurement device is configured for measuring potential of said plasma-facing sensor; and a signal processor, wherein said signal processor is configured for analyzing said current discharge rate and said potential of said plasma-facing sensor to determine a voltage-current characteristic for said plasma-facing sensor. - View Dependent Claims (19, 20)
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Specification