Base plate for use in a multi-chip module
First Claim
1. A base mechanism for use in a multi-chip module (MCM), comprising:
- a first substrate having a first surface and a second surface, wherein first electrical connectors that convey power are disposed on the first surface, and wherein the first substrate includes through-substrate vias (TSVs) between the first surface and the second surface which are electrically coupled to the first electrical connectors;
a bridge chip rigidly mechanically coupled to the second surface, wherein proximity communication connectors are disposed on a top surface of the bridge chip to communicate information via proximity communication with one or more island chips in the MCM; and
spacers, rigidly mechanically coupled to the second surface, which in conjunction with the bridge chip define cavities on the second surface that have a depth, wherein second electrical connectors are disposed on the second surface within the cavities to communicate additional information with and convey power to the one or more island chips, and wherein the second electrical connectors are electrically coupled to the TSVs, wherein the second electrical connectors in the cavities are configured to couple directly to corresponding electrical connectors on the island chips.
2 Assignments
0 Petitions
Accused Products
Abstract
A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.
-
Citations
20 Claims
-
1. A base mechanism for use in a multi-chip module (MCM), comprising:
-
a first substrate having a first surface and a second surface, wherein first electrical connectors that convey power are disposed on the first surface, and wherein the first substrate includes through-substrate vias (TSVs) between the first surface and the second surface which are electrically coupled to the first electrical connectors; a bridge chip rigidly mechanically coupled to the second surface, wherein proximity communication connectors are disposed on a top surface of the bridge chip to communicate information via proximity communication with one or more island chips in the MCM; and spacers, rigidly mechanically coupled to the second surface, which in conjunction with the bridge chip define cavities on the second surface that have a depth, wherein second electrical connectors are disposed on the second surface within the cavities to communicate additional information with and convey power to the one or more island chips, and wherein the second electrical connectors are electrically coupled to the TSVs, wherein the second electrical connectors in the cavities are configured to couple directly to corresponding electrical connectors on the island chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. An MCM, comprising:
-
one or more island chips having first proximity communication connectors disposed on first surfaces of the one or more island chips; and a base mechanism, including; a first substrate having a second surface and a third surface, wherein first electrical connectors that convey power are disposed on the second surface, and wherein the first substrate includes through-substrate vias (TSVs) between the second surface and the third surface which are electrically coupled to the first electrical connectors; a bridge chip rigidly mechanically coupled to the third surface, wherein second proximity communication connectors are disposed on a top surface of the bridge chip to communicate information via proximity communication with the first proximity communication connectors of the one or more island chips; and spacers, rigidly mechanically coupled to the third surface, which in conjunction with the bridge chip define cavities on the third surface that have a depth, wherein second electrical connectors are disposed on the third surface within the cavities to communicate additional information with and convey power to the one or more island chips, and wherein the second electrical connectors are electrically coupled to the TSVs, wherein the second electrical connectors in the cavities are configured to couple directly to corresponding electrical connectors on the island chips.
-
-
18. A method for assembling an MCM, comprising:
-
placing one or more island chips proximate to cavities in a base mechanism in the MCM that comprises a substrate, wherein the cavities are defined by spacers and a bridge chip on a top surface of the base mechanism, wherein the bridge chip is rigidly mechanically coupled to the top surface of the base mechanism, wherein there are electrical connectors disposed on the top surface of the base mechanism within the cavities that are configured to couple directly to corresponding electrical connectors on the island chips, and wherein there are proximity communication connectors disposed on a top surface of the bridge chip to communicate information via proximity communication with the one or more island chips; and applying a pressure, via at least one pressure plate, to top surfaces of one or more island chips in the MCM while rigid mechanical coupling between bottom surfaces of the island chips and the top surface of the base mechanism in the MCM is established via the electrical connectors. - View Dependent Claims (19, 20)
-
Specification