Method of manufacturing a printed circuit board
First Claim
Patent Images
1. A method of manufacturing a printed circuit board (PCB) having at least one conductive layer and at least one non-conductive layer and forming a first surface and a second surface, said method comprising:
- disposing at least one via through the PCB to connect the surfaces wherein the at least one via includes a metallic portion having a pair of ends and defining a hole;
filling the hole of the at least one via with a solder mask to a certain level between the ends; and
coating at least a portion of one of the surfaces of the PCB with an organic solderability preservative (OSP).
9 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of capacity while the electrical vias are completely filled. Once filled, surfaces of the PCB are coated with an organic solderability preservative.
46 Citations
11 Claims
-
1. A method of manufacturing a printed circuit board (PCB) having at least one conductive layer and at least one non-conductive layer and forming a first surface and a second surface, said method comprising:
-
disposing at least one via through the PCB to connect the surfaces wherein the at least one via includes a metallic portion having a pair of ends and defining a hole; filling the hole of the at least one via with a solder mask to a certain level between the ends; and coating at least a portion of one of the surfaces of the PCB with an organic solderability preservative (OSP). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method of manufacturing a printed circuit board (PCB) having a pair of conductive layers and at least one non-conductive layer sandwiched between said conductive layers and wherein said conductive layers define a first surface and a second surface, said method comprising:
-
disposing at least one electrical via defining a pair of ends and a hole extending between said ends through the layers to electrically connect the conductive layers; completely filling the hole of the electrical via with a solder mask; disposing at least one thermal transfer via defining a pair of ends and a hole extending between said ends through the layers to connect the surfaces; and partially filling the hole of the thermal transfer via with a solder mask. - View Dependent Claims (11)
-
Specification