MEMS package and method for the production thereof
First Claim
Patent Images
1. A micro electro-mechanical systems (MEMS) package, comprising:
- a carrier substrate having a top side,a MEMS chip mounted on the top side of the carrier substrate, the MEMS chip having an active side facing the carrier substrate and a passive side facing away from the carrier substrate, the passive side including a recess formed in the MEMS chip;
a cover in contact with a portion of the passive side of the MEMS chip and covering the recess in the passive side of the MEMS chip to enclose a back volume of the MEMS chip;
at least one chip component on the top side of the carrier substrate beside the MEMS chip, anda thin metallic shielding layer covering the MEMS chip and the at least one chip component and forming a seal with the top side of the carrier substrate,wherein the MEMS chip and the at least one chip component are electrically connected to each other or with external contacts on the carrier substrate.
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Abstract
A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
243 Citations
21 Claims
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1. A micro electro-mechanical systems (MEMS) package, comprising:
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a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, the MEMS chip having an active side facing the carrier substrate and a passive side facing away from the carrier substrate, the passive side including a recess formed in the MEMS chip; a cover in contact with a portion of the passive side of the MEMS chip and covering the recess in the passive side of the MEMS chip to enclose a back volume of the MEMS chip; at least one chip component on the top side of the carrier substrate beside the MEMS chip, and a thin metallic shielding layer covering the MEMS chip and the at least one chip component and forming a seal with the top side of the carrier substrate, wherein the MEMS chip and the at least one chip component are electrically connected to each other or with external contacts on the carrier substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification