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Semiconductor device with integrated coils

  • US 8,169,285 B2
  • Filed: 05/25/2007
  • Issued: 05/01/2012
  • Est. Priority Date: 05/25/2007
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a number of integrated coils;

    a first layer;

    a second layer made from a first material, the second layer comprising an upper wall and a side wall substantially perpendicular to the upper wall; and

    a chamfered adhesive material different from the first material, the chamfered adhesive material in direct contact with the side wall of the second layer,wherein a conductive line of a first coil portion is positioned on the first layer and a conductive line of a second coil portion is positioned on the upper wall of the second layer and the chamfered adhesive material, which is in direct contact with the side wall of the second layer.

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