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Radio frequency identification tag with tamper detection capability

  • US 8,169,318 B2
  • Filed: 08/30/2004
  • Issued: 05/01/2012
  • Est. Priority Date: 08/29/2003
  • Status: Active Grant
First Claim
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1. An RFID tag, comprising:

  • a first substrate having oppositely facing first and second surfaces;

    a second substrate having oppositely facing first and second surfaces, the first surface of the second substrate facing the second surface of the first substrate;

    an RFID integrated circuit fixed to the first substrate so that the RFID integrated circuit and the first substrate together form an RFID integrated circuit module;

    an RFID antenna disposed on the first surface of the second substrate and electrically coupled to the RFID integrated circuit via a non-contact coupling;

    an electrically conductive region disposed on the second surface of the second substrate and electrically coupled to the RFID integrated circuit via a non-contact coupling;

    a first adhesive layer between a surface of the RFID integrated circuit facing the second substrate and the first surface of the second substrate, the first adhesive layer attaching the RFID integrated circuit module to the second substrate;

    the RFID integrated circuit being fixed to the second surface of the first substrate by a second adhesive layer;

    at least one electrical coupling circuit on the second surface of the first substrate and connected to the RFID integrated circuit, the at least one electrical coupling circuit electrically coupling the RFID integrated circuit to the electrically conductive region via a non-contact coupling, and the at least one electrical coupling circuit electrically coupling the RFID integrated circuit to the RFID antenna via a non-contact coupling;

    an adhesion modifying layer associated with the first and/or second adhesive layer, the adhesion modifying layer modifying adhesion of the RFID integrated circuit or the at least one electrical coupling circuit so that the RFID integrated circuit and/or the at least one electrical coupling circuit is modified if the RFID integrated circuit module is removed from the second substrate to indicate tampering of the RFID tag; and

    an attachment layer on the second surface of the second substrate for attaching the second substrate to a receiving surface.

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