Power supply and heat dissipation module thereof

• US 8,169,781 B2
• Filed: 04/06/2010
• Issued: 05/01/2012
• Est. Priority Date: 04/06/2010
• Status: Active Grant

• Current Assignee: 3Y Power Technology, Inc. (FSP Technology Inc.), FSP Technology Inc.
• Original Assignee: 3Y Power Technology, Inc. (FSP Technology Inc.), FSP Technology Inc.
• Inventors: Lu, Shao-Feng
• Primary Examiner(s): Thomas, Bradley
• Application Number:
  US12/754,621
• Publication Number:
  US 20110242766A1
• Time in Patent Office: 756 Days
• Field of Search: 361/711, 361/704, 361/709, 361/718, 361/719, 361/679.54, 165/80.2, 165/80.3, 165/185, 454/184
• US Class Current: 361/711
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.

Claims

1. A power supply, comprising:

a casing, having a top cover;

a printed circuit board, disposed in the casing and having a heat-generating element;

a heat dissipation module, disposed inside the casing, the heat dissipation module comprising;

a heatsink, directly disposed at the printed circuit board and a standing part of the heatsink directly contacting the heat-generating element, wherein a top of the heatsink has a surface facing the top cover;

a heat dissipation planar-plate, disposed between the surface of the top of the heatsink and the top cover;

a heat-conducting planar-pad, directly disposed on the surface of the top of the heatsink and directly contacting the heat dissipation planar-plate, wherein the heat-conducting planar-pad is used for transferring thermal energy from the heatsink to the heat dissipation planar-plate; and

a plurality of fixing pillars fixed between the heat dissipation planar-plate and the casing,

wherein the heat dissipation planar-plate has a plurality of through holes, the through holes are used for enhancing air convection inside the power supply, so as to further increase heat dissipation efficiency,

wherein there is a first interval between the heat dissipation planar-plate and the printed circuit board, there is a second interval between the top cover and the printed circuit board, and the second interval is greater than the first interval,

wherein the heat conducting planar-pad is made of heat-conducting but insulated material.

2. The power supply as claimed in claim 1, wherein the material of the fixing pillars is copper.

3. The power supply as claimed in claim 1, wherein the heat-generating element is a diode.

4. The power supply as claimed in claim 1, wherein the heatsink is a T-shaped heatsink.

5. A heat dissipation module, suitable for a power supply comprising a casing and a printed circuit board, wherein the casing has a top cover, the printed circuit board is disposed in the casing and has a heat-generating element, and the heat dissipation module comprises:

a heatsink, directly disposed at the printed circuit board and a standing part of the heatsink directly contacting the heat-generating element, wherein a top of the heatsink has a surface facing the top cover;

a heat dissipation planar-plate, disposed between the surface of the top of the heatsink and the top cover;

a heat-conducting planar-pad, directly disposed on the surface of the top of the heatsink and directly contacting the heat dissipation planar-plate, wherein the heat-conducting planar-pad is used for transferring thermal energy from the heatsink to the heat dissipation planar-plate; and

a plurality of fixing pillars fixed between the heat dissipation planar-plate and the casing,

wherein the heat dissipation module is disposed inside the casing, and

wherein the heat dissipation planar-plate has a plurality of through holes, the through holes are used for enhancing air convection inside the power supply, so as to further increase heat dissipation efficiency,

wherein there is a first interval between the heat dissipation planar-plate and the printed circuit board, there is a second interval between the top cover and the printed circuit board, and the second interval is greater than the first interval,

wherein the heat conducting planar-pad is made of heat-conducting but insulated material.

6. The heat dissipation module as claimed in claim 5, wherein the material of the fixing pillars is copper.

7. The heat dissipation module as claimed in claim 5, wherein the heatsink is a T-shaped heatsink.