Circuit module

• US 8,169,784 B2
• Filed: 09/26/2008
• Issued: 05/01/2012
• Est. Priority Date: 09/27/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Semiconductor Company Limited (ON Semiconductor Corporation), Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Sakamoto, Hideyuki, Saito, Hidefumi, Koike, Yasuhiro, Tsukizawa, Masao
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US12/239,215
• Publication Number:
  US 20090086442A1
• Time in Patent Office: 1,313 Days
• Field of Search: 361775-784, 174520-523, 257691-692, 257787-790
• US Class Current: 361/729
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

Claims

1. A circuit module comprising:

a first module substrate comprising a first substrate comprising a metal, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of an electrically-conductive material and disposed on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate;

a second module substrate comprising a resin substrate, a plurality of second conductive patterns made of an electrically-conductive material and disposed on a top surface of the resin substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and

a casing member comprising a resin and holding opposing sides of the first module substrate and opposing sides of the second module substrate that is disposed above the first module substrate with an empty space in between,

wherein the drive device is positioned off the center of the resin substrate, and

the second module substrate is configured to be an outermost top cover of the circuit module, and, in plan view of the circuit module, there is an opening between an edge of the second module substrate and a sidewall of the casing member so that the empty space is connected to atmosphere outside the circuit module through the opening.

2. The circuit module according to claim 1, wherein heat generated by the switching semiconductor device is released outside through the opening.

3. A circuit module comprising:

a first module substrate comprising a base substrate comprising a metal, at least a top surface of the base substrate being electrically insulated, a first substrate fixed on the base substrate, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of an electrically-conductive material and disposed on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate;

a second module substrate comprising a second substrate comprising a resin, a plurality of second conductive patterns made of an electrically-conductive material and disposed on a top surface of the second substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and

a casing member comprising a resin and holding opposing sides of the first module substrate and opposing sides of the second module substrate that is disposed above the first module substrate with an empty space in between, wherein

the drive device is positioned off the center of the second substrate, and

the second module substrate is configured to be an outermost top cover of the circuit module, and, in plan view of the circuit module, there is an opening between an edge of the second module substrate and a sidewall of the casing member so that the empty space is connected to atmosphere outside the circuit module through the opening.

4. The circuit module according to claim 3, wherein the first substrate is a metal substrate comprising aluminum or copper, and the second substrate is a glass epoxy substrate.

5. A circuit module comprising:

a first module substrate comprising an aluminum base substrate with a rectangular shape, at least a top surface of the aluminum base substrate being electrically insulated, a first substrate comprising aluminum with a rectangular shape fixed onto the aluminum base substrate by an insulating adhesive and disposed inside a periphery of the base substrate, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of an electrically-conductive material and disposed on the top surface of the first substrate, and a switching semiconductor device electrically connected with the first conductive patterns and mounted on the first module substrate, the switching semiconductor device being configured to work with an inverter;

a second module substrate comprising a second substrate comprising a resin, a plurality of second conductive patterns made of an electrically-conductive material and disposed on a top surface of the second substrate, and a microcomputer electrically connected with the second conductive patterns and controlling the switching semiconductor device; and

a casing member comprising a resin and shaped like a quadrangular prism having a hollow portion penetrating from an upper surface to a lower surface thereof, the lower surface of the casing member abutting four sides of the base substrate, the casing member comprising a holding unit holding a back surface of the second substrate inserted in the hollow portion so as to be above the first module substrate with an empty space in between, wherein

the microcomputer is positioned off the center of the second substrate,

the second module substrate is configured to be an outermost top cover of the circuit module and to close the hollow portion, and, in plan view of the circuit module, there is an opening between an edge of the second module substrate and a sidewall of the casing member so that the empty space is connected to atmosphere outside the circuit module through the opening.