Electronic module and method for producing such a module

• US 8,169,791 B2
• Filed: 11/09/2006
• Issued: 05/01/2012
• Est. Priority Date: 12/28/2005
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Wolf, Kuno, Koester, Thomas, Hornung, Stefan, Feiler, Wolfgang
• Primary Examiner(s): Chervinsky, Boris
• Application Number:
  US12/092,920
• Publication Number:
  US 20080247142A1
• Time in Patent Office: 2,000 Days
• Field of Search: None
• US Class Current: 361/783
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive substrate (18) mounted on it, and having at least one power component which is arranged on a first substrate (16), and the second substrate (18) is fitted with further components (40) on a side (32) which is remote from the first substrate (16), where the second substrate (18) has a smaller base area (19) than the basic body (54) of the first substrate (16), and the power components (22) are mounted on the first substrate (16) outside the outer perimeter (70) of the second substrate (18)—next to the latter.

Claims

1. An electronic module, comprising an electrically conductive first substrate having a base body;

a second electronically conductive substrate secured on said first substrate;

at least one power component located on said first substrate, wherein said second substrate is assembled with further components on a side facing away from said first substrate, wherein said second substrate has a base which is smaller than said base body of said first substrate; and

power components arranged outside an outer circumference of said second substrate besides said second substrate and secured to said first substrate, wherein said first substrate is a stamped grid with securing elements integrally formed on it and used for fixation and wherein said power components are bare die elements without a housing comprising power MOSFETs.

2. An electronic module as defined in claim 1, wherein said power components are connected with said first substrate in a manner selected from the group consisting of soldered on said first substrate and conductively adhesively bonded with said first substrate.

3. An electronic module as defined in claim 1, wherein said power components are electrically conductively connected to said first substrate by die attaching.

4. An electronic module as defined in claim 1, wherein said second substrate is electrically insulatingly adhesively bonded to said first substrate.

5. An electronic module as defined in claim 1, wherein said power components have electrical connections selected from the group consisting of electrical connections connecting said power components with one another, electrical connections connecting said power components with said second substrate, electrical connections connecting said power component with said first substrate, and combinations thereof, wherein said electrical connections of said power components are bond wires.

6. An electronic module as defined in claim 1, wherein said second substrate is a hybrid ceramic, on which electronic components are located, wherein said electronic components are components selected from the group consisting of a microprocessor, a triggering logic element, a position sensor element for an armature shaft of an electric motor, and combinations thereof, and wherein said electronic components are assembled variably by a technology selected from the group consisting of SMD technology and flip-chip technology with use of soldering technology.

7. An electronic module as defined in claim 1, wherein said power components in peripheral regions of said base body of said first substrate are located substantially symmetrically with respect to said second substrate.

8. An electronic module as defined in claim 1, wherein one of said power components and a shunt for current measurement are soldered or adhesively bonded to said first substrate.

9. An electronic module as defined in claim 1, wherein said base body of said first substrate and said second substrate together are extrusion-coated on a plastic body so that extensions integrally formed on said base body protrude from said plastic body and form an interface selected from the group consisting of an electrical interface, a mechanical interface, and both for attaching further motor components.

10. An electronic module as defined in claim 9, wherein said first substrate, toward said second substrate, has a plane surface extending continuously at least inside said plastic body in a single horizontal plane.