×

Failure detecting method, failure detecting apparatus, and semiconductor device manufacturing method

  • US 8,170,707 B2
  • Filed: 10/22/2008
  • Issued: 05/01/2012
  • Est. Priority Date: 10/30/2007
  • Status: Active Grant
First Claim
Patent Images

1. A failure detecting method comprising:

  • inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process;

    inputting a die sort map created by a die sort test after the wafer processing process;

    setting a plurality of region segments in the wafer;

    setting a region number for each of the region segments;

    calculating foreign substance density in each of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount;

    calculating failure density in each of the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount;

    calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount; and

    identifying a processing process that is a cause of failure occurrence, based on the similarity,wherein a plurality of first regions, into which the wafer is divided in a radial direction, and a plurality of fan-shaped second regions, into which the wafer is divided in a central angle direction, are combined to set the plurality of region segments.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×