Methods of fabrication of a simulation lead

• US 8,171,621 B2
• Filed: 09/30/2010
• Issued: 05/08/2012
• Est. Priority Date: 09/30/2009
• Status: Expired due to Fees

• Current Assignee: Advanced Neuromodulation Systems Incorporated (Abbott Laboratories)
• Original Assignee: Advanced Neuromodulation Systems Incorporated (Abbott Laboratories)
• Inventors: Swanson, John, Turner, Kevin, Boogaard, Jerome
• Primary Examiner(s): Arbes, Carl
• Application Number:
  US12/895,466
• Publication Number:
  US 20110072659A1
• Time in Patent Office: 586 Days
• Field of Search: 298/25, 298/74, 298/76, 295/921, 607/45, 607/46, 607/116
• US Class Current: 29/825
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: H01R 13/035 Plated dielectric material
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 2201/12 for medicine and surgery
• CPC Class Codes: H01R 24/58 Contacts spaced along longitudinal axis of engagement
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

In one embodiment, a method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprises: providing an elongated, substantially cylindrical substrate, the substrate comprising a plurality of recesses defined in an outer surface of the substrate; coating the substrate with conductive material; patterning conductive material on the substrate to form a plurality of electrode surfaces for at least the plurality of segmented electrodes and a plurality of traces connected to the plurality of electrode surfaces, wherein each electrode surface and its corresponding trace are defined in the recesses on the outer surface of the substrate and are electrically isolated from other electrode surfaces and traces; providing insulative material over at least the plurality of traces; and electrically coupling the plurality of traces to conductive wires of a lead body.

Claims

1. A method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprising:

providing an elongated, substantially cylindrical substrate, the substrate comprising a plurality of recesses defined in an outer surface of the substrate;

coating the substrate with conductive material, the coating including vapor depositing a first conductive material and subsequent to the deposition of the first conductive material, vapor depositing a second conductive material;

patterning conductive material on the substrate to form a plurality of electrode surfaces for at least the plurality of segmented electrodes and a plurality of traces connected to the plurality of electrode surfaces, wherein each electrode surface and its corresponding trace are defined in the recesses on the outer surface of the substrate and are electrically isolated from other electrode surfaces and traces;

providing insulative material over at least the plurality of traces; and

electrically coupling the plurality of traces to conductive wires of a lead body.

2. The method of claim 1 further comprising:

providing a plurality of weld tubes at a proximal end of the substrate;

wherein the electrically coupling comprises welding the conductive wires to the plurality of weld tubes.

3. The method of claim 2 wherein the substrate comprises a plurality of vias with conductive material disposed in the vias, the conductive material in the plurality of vias electrically connecting conductive material of the electrode surfaces with the plurality of weld tubes.

4. The method of claim 1 wherein the electrically coupling comprises welding the conductive wires to the plurality of traces.

5. The method of claim 1 wherein the patterning comprises laser ablating conductive material from the substrate.

6. The method of claim 1 wherein the coating further comprises:

subsequent to vapor deposition of conductive material, plating conductive material over the vapor deposited conductive material.

7. The method of claim 6 wherein the plated conductive material is platinum.

8. The method of claim 1 wherein the plurality of electrode surfaces further comprise surfaces for a tip electrode and ring electrode.

9. A method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprising:

providing an elongated, substantially cylindrical substrate, the substrate comprising (i) a plurality of recesses defined in an outer surface of the substrate and (ii) a plurality of apertures, at a proximal end of the substrate, extending longitudinally within the substrate;

coating the substrate with conductive material, the coating including vapor depositing a first conductive material and subsequent to the deposition of the first conductive material, vapor depositing a second conductive material;

patterning conductive material on the substrate to form a plurality of electrode surfaces for at least the plurality of segmented electrodes and a plurality of traces connected to the plurality of electrode surfaces, wherein each electrode surface and its corresponding trace are defined in the recesses on the outer surface of the substrate and are electrically isolated from other electrode surfaces and traces;

providing insulative material over at least the plurality of traces; and

electrically coupling the plurality of traces to conductive wires of a lead body through the plurality of apertures at the proximal end of the substrate.

10. The method of claim 9 further comprising:

inserting a pin within a central aperture defined in the proximal end of the substrate.

11. The method of claim 9 further comprising:

providing a plurality of weld tubes within the plurality of apertures at a proximal end of the substrate;

wherein the electrically coupling comprises welding the conductive wires to the plurality of weld tubes.

12. The method of claim 11 wherein the substrate comprises a plurality of vias with conductive material disposed in the vias, the conductive material in the plurality of vias electrically connecting conductive material of the electrode surfaces with the plurality of weld tubes.

13. The method of claim 9 wherein the patterning comprises laser ablating conductive material from the substrate.

14. The method of claim 9 wherein the coating further comprises:

subsequent to vapor deposition of conductive material, plating conductive material over the vapor deposited conductive material.

15. The method of claim 14 wherein the plated conductive material is platinum.

16. The method of claim 9 wherein the plurality of electrode surfaces further comprise surfaces for a tip electrode and ring electrode.

17. A method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprising:

providing an elongated, substantially cylindrical substrate, the substrate comprising a plurality of recesses defined in an outer surface of the substrate;

coating the substrate with conductive material, the coating including vapor depositing conductive material on the substrate;

subsequent to vapor deposition of conductive material, plating conductive material over the vapor deposited conductive material;

patterning conductive material on the substrate to form a plurality of electrode surfaces for at least the plurality of segmented electrodes and a plurality of traces connected to the plurality of electrode surfaces, wherein each electrode surface and its corresponding trace are defined in the recesses on the outer surface of the substrate and are electrically isolated from other electrode surfaces and traces;

providing insulative material over at least the plurality of traces; and

electrically coupling the plurality of traces to conductive wires of a lead body.

18. The method of claim 17 further comprising:

providing a plurality of weld tubes at a proximal end of the substrate;

wherein the electrically coupling comprises welding the conductive wires to the plurality of weld tubes.

19. The method of claim 18 wherein the substrate comprises a plurality of vias with conductive material disposed in the vias, the conductive material in the plurality of vias electrically connecting conductive material of the electrode surfaces with the plurality of weld tubes.