Method and system for preparing wireless communication chips for later processing

• US 8,171,624 B2
• Filed: 09/11/2009
• Issued: 05/08/2012
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US12/558,406
• Publication Number:
  US 20100000076A1
• Time in Patent Office: 970 Days
• Field of Search: 296/00, 29830-832, 295/921, 297/29, 297/39, 343/700.MS, 343/768, 3405721-5727, 438/613, 438/618
• US Class Current: 29/832
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method of preparing wireless communication chips for later processing includes receiving a carrier tape that is carrying a wireless communication chip positioned inside a container on the carrier tape and beneath a protective adhesive. The protective adhesive is stripped from the carrier tape. Using an apparatus having a first roller, the carrier tape is passed over the first roller, and the wireless communication chip is forced into contact with an adhesive tape for later processing. Also disclosed is a system for preparing wireless communication chips for later processing.

Claims

1. A method of preparing wireless communication chips for later processing, the method comprising:

receiving a carrier tape that is carrying a wireless communication chip positioned inside a container on the carrier tape and beneath a protective adhesive;

stripping the protective adhesive from the carrier tape;

using an apparatus having a first roller, passing the carrier tape over the first roller; and

forcing the wireless communication chip into contact with an adhesive tape for later processing.

2. The method of claim 1, further comprising joining the wireless communication chip to an antenna element to form a wireless communication device.

3. The method of claim 2, wherein said joining the wireless communication chip to an antenna element comprises passing a substrate having the antenna element and the adhesive tape between two heated rollers to secure the wireless communication chip to the antenna element.

4. The method of claim 2, wherein said joining the wireless communication chip to an antenna element comprises:

heating pins of the wireless communication chip; and

positioning the pins of the wireless communication chip in contact with fingers cut into the antenna element.

5. The method of claim 2, wherein said joining the wireless communication chip to an antenna element comprises inserting heated pins of the wireless communication chip into a low-melting-point solder preloaded with the antenna element.

6. The method of claim 1, wherein said forcing the wireless communication chip into contact with an adhesive tape comprises pushing the wireless communication chip onto the adhesive tape using the first roller in proximity to a second roller.

7. The method of claim 6, wherein said passing the carrier tape over the first roller comprises passing the carrier tape between the first roller and the second roller.

8. The method of claim 6, wherein said pushing the wireless communication chip onto the adhesive tape comprises rotating each of the first and second rollers at a respective rotational frequency to position each of a plurality of wireless communication chips successively carried by the carrier tape a desired distance apart on the adhesive tape.

9. The method of claim 8, wherein the first roller and the second roller have an oval shape.

10. The method of claim 1, wherein the first roller comprises teeth.

11. The method of claim 10, wherein said forcing the wireless communication chip into contact with an adhesive tape comprises pushing the wireless communication chip into contact with the adhesive tape using teeth of the first roller.

12. A system for preparing wireless communication chips for later processing, the system comprising:

means for stripping a protective adhesive from a carrier tape that is carrying a wireless communication chip positioned inside a container on the carrier tape and beneath the protective adhesive;

a first roller;

means for passing the carrier tape over the first roller; and

means for forcing the wireless communication chip into contact with an adhesive tape for later processing.

13. The system of claim 12, wherein said means for stripping a protective adhesive from a carrier tape includes a waste roller configured to strip the protective adhesive from the carrier tape by wrapping the protective adhesive therearound when rotating such that the wireless communication chip is exposed within the container.

14. The system of claim 12, further comprising a second roller configured to rotate proximate to the first roller, wherein the first and second rollers are configured to pass the carrier tape simultaneously with an adhesive tape fed to the system such that the wireless communication chips are forced into contact with the adhesive tape.

15. The system of claim 14, wherein the carrier tape and the adhesive tape are configured to be fed between the first and second rollers.

16. The system of claim 14, wherein the first and second rollers have an oval shape.

17. The system of claim 14, wherein each of the first and second rollers are configured to rotate at a respective rotational frequency to position each of a plurality of wireless communication chips successively carried by the carrier tape a desired distance apart on the adhesive tape.

18. The system of claim 12, wherein the wireless communication chip is configured to be forced into contact with the adhesive tape such that the wireless communication chip is retained on a sticky surface of the adhesive tape for later processing.

19. The system of claim 12, wherein the first roller includes at least one tooth that is configured to force the wireless communication chip into contact with the adhesive tape by pushing the wireless communication chips into contact with the adhesive tape.