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Maintenance system, substrate processing apparatus, remote operation unit and communication method

  • US 8,171,879 B2
  • Filed: 02/17/2009
  • Issued: 05/08/2012
  • Est. Priority Date: 08/27/2002
  • Status: Active Grant
First Claim
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1. A substrate processing apparatus, comprising:

  • various types of elements including a substrate carrier member for performing a substrate processing;

    a control section in which a remote operation information transmitted from a remote control unit in a remote place through a communication network is provided only when there is an allow setting of a remote operation by a worker of said substrate processing apparatus with the safety of the remote operation work being confirmed, and said various types of elements are controlled based on the provided remote operation information; and

    an allow-setting section for performing the allow setting of the remote operation,wherein in the allow-setting section, the allow setting of the remote operation is divided into plurality stages, and a first allow setting of the remote operation accompanying a driving of said substrate processing apparatus and a second allow setting of the remote operation not accompanying the driving of said substrate processing are included in separate stages,wherein the first allow setting of the remote operation accompanying the driving of said substrate processing apparatus comprises,a position adjustment for a substrate carrier arm, a resist solution discharge nozzle in a resist coating unit and a developing solution discharge nozzle in a developing unit, anda movement confirmation of the substrate carrier arm, the resist solution discharge nozzle and the developing solution discharge nozzle, andwherein the second allow setting of the remote operation not accompanying the driving of said substrate processing apparatus comprises,a setting change for a discharge amount of the resist solution, a discharge pressure of the resist solution, a turning speed of a substrate, an atmospheric temperature and an atmospheric humidity in the resist coating unit,a setting change for a discharge amount of the developing solution, a discharge pressure of the developing solution, an atmospheric temperature and an atmospheric humidity in the developing unit, anda setting change for a heating temperature and a heating time of the substrate in a heating unit.

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