Method of fabricating an entity and corresponding device

• US 8,173,056 B2
• Filed: 11/13/2007
• Issued: 05/08/2012
• Est. Priority Date: 11/17/2006
• Status: Active Grant

• Current Assignee: IDEMIA France (Advent International Corporation)
• Original Assignee: Oberthur Technologies SA
• Inventors: Cook, David, Lencou, Philippe
• Primary Examiner(s): Lee, Edmund H.
• Application Number:
  US12/514,537
• Publication Number:
  US 20100038820A1
• Time in Patent Office: 1,638 Days
• Field of Search: None
• US Class Current: 264/272.14
• CPC Class Codes: B29C 2045/0079 applying a coating or covering
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: B29C 45/0053 combined with a final operation, e.g. shaping injection-compression moulding B29C45/561
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/14647 Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07716 the record carrier comprising means for customization, e.g. being arranged for personalization in batch
• CPC Class Codes: G06K 19/07724 the record carrier being at least partially made by a molding process molding in general B29C45/14

Abstract

A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould (26). A corresponding device is also described.

Claims

1. A method of fabricating an electronic entity, comprising the steps of:

forming at least part of the entity by hardening a material in a mold;

personalizing the entity while in the mold, including electrically personalizing the entity by storing data in a memory of the electronic entity; and

removing the personalized entity from the mold.

2. A method according to claim 1, wherein the step of personalizing occurs while the material is hardening.

3. A method according to claim 1, wherein the step of personalizing occurs while the material is flowing into the mold.

4. A method according to claim 1, wherein the step of personalizing includes forming a graphical representation on a face of the entity.

9. A method according to claim 1, wherein the mold is an open mold.

10. A method according to claim 9, wherein a forming plate is applied against said material in an open part of the mold.

12. A method according to claim 1, wherein the step of forming includes injection molding said part of the entity.

13. A method according to claim 1, wherein a plurality of entities are formed within said mold.

14. A method according to claim 13, wherein personalization of said entities is performed simultaneously.

15. A method according to claim 1, wherein the electronic entity is a USB key.

16. A method according to claim 1, wherein the electronic entity is a microcircuit card.

17. A method according to claim 16, wherein the microcircuit card is in conformity with ISO7816.

5. A method of fabricating an electronic entity, comprising the steps of:

forming at least part of the entity by hardening a material in a mold; and

personalizing the entity while in the mold, including storing data in a memory of the electronic entity,

wherein a contact plate of the entity electrically linked to the memory is connected to a personalization equipment while the entity is in the mold.

6. A method according to claim 5, wherein a contact head connected to the personalization equipment is inserted in an opening of the mold for contacting the contact plate.

7. A method according to claim 5, wherein at least one conductor extending through the mold contacts the contact plate for connection to the personalization equipment.

8. A method of fabricating an electronic entity, comprising the steps of:

forming at least part of the entity by hardening a material in a mold; and

personalizing the entity while in the mold, including storing data in a memory of the electronic entity,

wherein the step of personalizing includes exchanging said data through contactless communication between a microcircuit connected to the memory and a contactless head connected to the personalization equipment.

11. A method according to claim 8, wherein the contactless head faces an open side of the mold, and the mold is an open mold.

18. A device for fabricating an electronic entity, comprising:

a mold for forming at least part of the entity by hardening a material; and

means for personalizing the entity while in the mold,

wherein the means for personalizing includes means for electrically personalizing the entity by storing data in a memory of the electronic entity.

19. A device according to claim 18, wherein the means for personalizing includes means for forming a graphical representation on a face of the entity.

24. A device according to claim 18, wherein the mold is an open mold.

25. A device according to claim 24, wherein a forming plate is applied against said material in an open part of the mold.

27. A device according to claim 18, wherein said mold is adapted to injection molding said part of the entity.

28. A device according to claim 18, wherein said mold is adapted to form a plurality of entities.

29. A device according to claim 28, including means for simultaneously personalizing said entities.

30. A device according to claim 18, wherein the electronic entity is a USB key.

31. A device according to claim 18, wherein the electronic entity is a microcircuit card.

32. A device according to claim 31, wherein the microcircuit card is in conformity with ISO7816.

33. A device according to claim 18, further comprising means for removing the personalized entity from the mold.

20. A device for fabricating an electronic entity, comprising:

a mold for forming at least part of the entity by hardening a material;

means for connecting a contact plate of the entity electrically linked to the memory to a personalization equipment while the entity is in the mold; and

means for personalizing the entity while in the mold,

wherein the means for personalizing includes means for storing data in a memory of the electronic entity.

21. A device according to claim 20, wherein a contact head connected to the personalization equipment is adapted for insertion in an opening of the mold for contacting the contact plate.

22. A device according to claim 20, wherein at least one conductor extending through the mold is adapted to contact the contact plate for connection to the personalization equipment.

23. A device, for fabricating an electronic entity, comprising:

a mold for forming at least part of the entity by hardening a material;

means for personalizing the entity while in the mold,

wherein the means for personalizing includes means for storing data in a memory of the electronic entity and means for exchanging said data through contactless communication between a microcircuit connected to the memory and a contactless head connected to the personalizing equipment.

26. A device according to claim 23, wherein the contactless head faces an open side of the mold, and the mold is an open mold.