Electronic package

• US 8,173,911 B2
• Filed: 11/25/2009
• Issued: 05/08/2012
• Est. Priority Date: 11/26/2008
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Hughes, Michael R., Hebert, James
• Primary Examiner(s): NGO, HUNG V
• Application Number:
  US12/626,361
• Publication Number:
  US 20100128456A1
• Time in Patent Office: 895 Days
• Field of Search: 174/369, 174/370, 174/386, 174/366, 361/816
• US Class Current: 174/369
• CPC Class Codes: H05K 9/0045 being rigid plastic containers having a coating of shielding material

Abstract

The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.

Claims

1. An electronic system package comprising an electrical conductive path therewithin, said electronic system package comprises:

a first member, a second member, and an electrically conductive gasket positioned between the first member and the second member, wherein the first member, the gasket and the second member form a housing for an electronic equipment,

wherein all the surfaces of the first member except for at least one opening portion is covered with a corrosive-resistant electrocoating or with a corrosive resistant powder-painted coating, wherein a portion of the surfaces of the first member including said at least one opening is covered with a first electrically conductive coating, wherein a surface of the second member is covered with a second electrically conductive coating,

wherein the electrical conductive path comprising the second electrically conductive coating, the gasket, the first electrically conductive coating and the metallic material of the first member is formed within the electronic package system.

2. The electronic system package of claim 1, wherein the second electrically conductive coating covers an interior surface of the second member.

3. The electronic system package of claim 1, wherein the first member comprises a base enclosure.

4. The electronic system package of claim 1, wherein the second member comprises a cover.

5. The electronic system package of claim 1, wherein the first member comprises an electrically conductive metallic material.

6. The electronic system package of claim 5, wherein the electrically conductive metallic material comprises magnesium or magnesium alloy.

7. The electronic system package of claim 1, wherein the second member comprises a polymeric material.

8. The electronic system package of claim 1, wherein a priming layer is disposed between the first member and the first electrically conductive coating.

9. The electronic system package of claim 8, wherein the priming layer comprises a chromate layer.

10. The electronic system package of claim 1, wherein either the first or the second conductive coating comprises a urethane binder with dispersed conductive metal fibers contained therein.

11. The electronic system package of claim 1, wherein the at least one opening is formed on an interior of the housing.

12. The electronic system package of claim 1, wherein the electrical conductive path forms an EMI shield.

13. The electronic system package of claim 1, wherein the first and second conductive coatings are substantially similar to each other.