Methods and systems for trimming circuits
First Claim
Patent Images
1. A method of removing material from the surface of a first circuit comprising:
- generating a first laser pulse using a pulse generator;
targeting a spot on the first circuit using a focusing component;
delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component;
ablating material from the spot using the first laser pulse without changing a state of the digital component; and
testing performance of the first circuit following the step of ablating material, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance,wherein targeting the spot on the first circuit comprises;
covering the first circuit using a thin conformal material configured to emit light when struck by a laser pulse of near-infrared wavelength;
generating and delivering a second laser pulse at a sub-ablation power through the thin conformal material, the second laser pulse being configured to cause the thin conformal material to emit light;
detecting the light emitted by the thin conformal material; and
using the light to guide the first laser pulse to the spot.
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Abstract
Various embodiments of the invention include methods and systems for trimming electronic circuits using short laser pulses of near-infrared wavelength at a high repetition rate. The laser pulses ablate material from a spot on a circuit with minimal thermal and photoelectric disturbances to circuit performance. Minimal disturbance to circuit performance allows for repeated trimming and testing without pausing for circuit reinitialization. To optimize trimming, the laser pulses can also be adjusted responsive to the composition of the material ablated. In some embodiments, the system is configured to trim a plurality of circuits in parallel.
495 Citations
13 Claims
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1. A method of removing material from the surface of a first circuit comprising:
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generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; and testing performance of the first circuit following the step of ablating material, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance, wherein targeting the spot on the first circuit comprises; covering the first circuit using a thin conformal material configured to emit light when struck by a laser pulse of near-infrared wavelength; generating and delivering a second laser pulse at a sub-ablation power through the thin conformal material, the second laser pulse being configured to cause the thin conformal material to emit light; detecting the light emitted by the thin conformal material; and using the light to guide the first laser pulse to the spot. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification