Unified test structure for stress migration tests

• US 8,174,010 B2
• Filed: 12/04/2007
• Issued: 05/08/2012
• Est. Priority Date: 04/30/2007
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Feustel, Frank, Limbecker, Pascal, Aubel, Oliver
• Primary Examiner(s): Monbleau, Davienne
• Assistant Examiner(s): Cruz, Leslie Pilar
• Application Number:
  US11/949,993
• Publication Number:
  US 20080265247A1
• Time in Patent Office: 1,617 Days
• Field of Search: 257/48, 257/E21.521, 438/14, 438/17, 438/18, 324/71.1, 324/71.5, 324/525
• US Class Current: 257/48
• CPC Class Codes: G01R 31/2858 Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A unified test structure which is applicable for all levels of a semiconductor device including a current path chain having a first half chain and a second half chain, wherein each half chain comprises lower metallization segments, upper metallization segments, an insulating layer between the lower metallization segments and the upper metallization segments, and connection segments. Each of the connection segments is electrically connected to a contact region of one of the lower metallization segments and to a contact region of one of the upper metallization segments to thereby electrically connect the respective lower metallization segment and the respective upper metallization segment, and the first half chain and the second half chain are of different configuration.

Claims

1. A test structure comprising a current path chain having a first half chain and a second half chain, wherein:

each half chain comprises lower metallization segments, upper metallization segments, an insulating layer between the lower metallization segments and the upper metallization segments, and connection segments;

each of said connection segments is electrically connected to a contact region of one of said lower metallization segments and to a contact region of one of said upper metallization segments to thereby electrically connect the respective lower metallization segment and the respective upper metallization segment;

at least one of the first half chain or the second half chain comprises a width less than a width of a probe pad; and

the first half chain and the second half chain have different configurations with different structural electrical characteristics, wherein the upper and lower metallization segments of the first half chain are different with respect to the upper and lower metallization segments of the second half chain.

2. The test structure according to claim 1, wherein, in the first half chain, each contact region is located at an end of the respective metallization segment, and in the second half chain, the metallization segments extend beyond the contact regions thereof.

3. The test structure of claim 1, wherein the connection segments comprise conductive plugs formed in contact holes of said insulating layer.

4. The test structure of claim 1, wherein the first half chain and the second half chain span a width which corresponds to a width of a probe pad.

5. The test structure of claim 1, wherein the first half chain is connected to a first probe pad and the second half chain is connected to a second probe pad.

6. The test structure of claim 1, wherein the first half chain and the second half chain are arranged in parallel.

7. The test structure of claim 1, further comprising:

at least three of said current path chains connected in series between two terminals; and

two further probe pads, each of which is connected between two of said current path chains.

8. The test structure of claim 1, wherein the first half chain and the second half chain span a width greater than or equal to a width approximately equal to a width of a probe pad.

9. The test structure of claim 1, wherein the first half chain and the second half chain collectively span a width less than a width of a probe pad.

10. The test structure of claim 1, further comprising at least two of said current path chains, wherein one of said half chains of a first current path chain is connected to a first probe pad and the other half chain of said first current path chain is connected to a second probe pad, and one half chain of a second current path chain is connected to the second probe pad.

11. The test structure of claim 10, wherein the first current path chain spans a width that is equal to a width of the first probe pad and the second current path chain spans a width that is equal to a width of the second probe pad.

12. The test structure of claim 1, wherein at least one of the first half chain and the second half chain are serpentine shaped having parallel chain portions.

13. The test structure of claim 12, wherein each of said chain portions of a half chain comprises three connection segments.

14. The test structure of claim 12, wherein each half chain comprises nine of said parallel chain portions.

15. The test structure of claim 12, wherein both of the first half chain and the second half chain are serpentine shaped having parallel chain portions and said chain portions of said first half chain are aligned with chain portions of the second half chain.

16. The test structure of claim 12, wherein the parallel chain portions are spaced from each other by a predetermined distance.

17. The test structure of claim 12, wherein, within each chain portion, the contact segments are spaced by a predetermined distance.

18. The test structure of claim 17, wherein the predetermined distance is approximately between 5 μ

m and 7 μ

m.

19. A test structure comprising a first current path chain having a first half chain and a second half chain, wherein:

each half chain comprises lower metallization segments, upper metallization segments, an insulating layer between the lower metallization segments and the upper metallization segments, and connection segments;

each of said connection segments is electrically connected to a contact region of one of said lower metallization segments and to a contact region of one of said upper metallization segments to thereby electrically connect the respective lower metallization segment and the respective upper metallization segment;

at least one of the first half chain or the second half chain comprises a width less than a width of a probe pad;

the first half chain and the second half chain have different configurations; and

further comprising at least a second current path chain having a first half chain and a second half chain, wherein one of said half chains of the first current path chain is connected to a first probe pad and the other half chain of said first current path chain is connected to a second probe pad, and one half chain of the second current path chain is connected to the second probe pad, and wherein the first current path chain spans a width that is equal to a width of the first probe pad and the second current path chain spans a width that is equal to a width of the second probe pad.