Light emitting device
First Claim
1. A light emitting device comprising a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a reflector provided surrounding the cap such that the reflector does not contact the cap, wherein the cap has top and bottom surfaces that are parallel to the top surface of the semiconductor light emitting element, and the spacing between the top and bottom surfaces is 1-3 times the longest diagonal or the diameter of the semiconductor light emitting element.
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Accused Products
Abstract
A light emitting device includes a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a reflector provided surrounding the cap. The cap has top and bottom surfaces that are parallel to the top surface of the semiconductor light emitting element, and the spacing between the top and bottom surfaces is 1-3 times the longest diagonal or the diameter of the semiconductor light emitting element. Also disclosed is a process for producing the device.
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Citations
8 Claims
- 1. A light emitting device comprising a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a reflector provided surrounding the cap such that the reflector does not contact the cap, wherein the cap has top and bottom surfaces that are parallel to the top surface of the semiconductor light emitting element, and the spacing between the top and bottom surfaces is 1-3 times the longest diagonal or the diameter of the semiconductor light emitting element.
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8. A process for production of a light emitting device comprising a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a reflector provided surrounding the cap such that the reflector does not contact the cap, wherein the cap has top and bottom surfaces that are parallel to the top surface of the semiconductor light emitting element, and the spacing between the top and bottom surfaces is 1-3 times the longest diagonal or the diameter of the semiconductor light emitting element, which process comprises bonding the cap onto the semiconductor light emitting element with a material having a refractive index that is not more than the refractive index of the cap.
Specification