Semiconductor device and method of manufacturing semiconductor device
First Claim
1. A semiconductor device comprising:
- a semiconductor layer;
a first conductivity type region of a first conductivity type disposed in a base layer portion of the semiconductor layer;
a body region of a second conductivity type disposed in the semiconductor layer so as to be in contact with the first conductivity type region;
a trench extending from a surface of the semiconductor layer to pass through the body region so that a deepest portion of the trench reaches the first conductivity type region;
a gate insulating film disposed on a bottom surface and a side surface of the trench;
a gate electrode having a gate width, and disposed in the trench on the gate insulating film;
a source region of the first conductivity type disposed on a side of the trench in a surface layer portion of the semiconductor layer so as to be in contact with the body region;
a high-concentration region of the second conductivity type disposed in the body region at a position opposed to the trench and having a higher second conductivity type impurity concentration than that of the body region; and
a channel implant region, containing a first conductivity type impurity, disposed in the body region between the trench and the high-concentration region.
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Accused Products
Abstract
A semiconductor device includes: a semiconductor layer; a first conductivity type region of a first conductivity type formed in a base layer portion of the semiconductor layer; a body region of a second conductivity type formed in the semiconductor layer to be in contact with the first conductivity type region; a trench formed by digging the semiconductor layer from the surface thereof to pass through the body region so that the deepest portion thereof reaches the first conductivity type region; a gate insulating film formed on the bottom surface and the side surface of the trench; a gate electrode buried in the trench through the gate insulating film; a source region of the first conductivity type formed in a surface layer portion of the semiconductor layer on a side in a direction orthogonal to the gate width with respect to the trench to be in contact with the body region; and a high-concentration region of the second conductivity type, formed in the body region on a position opposed to the trench in the direction orthogonal to the gate width, having a higher second conductivity type impurity concentration than that of the periphery thereof.
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Citations
12 Claims
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1. A semiconductor device comprising:
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a semiconductor layer; a first conductivity type region of a first conductivity type disposed in a base layer portion of the semiconductor layer; a body region of a second conductivity type disposed in the semiconductor layer so as to be in contact with the first conductivity type region; a trench extending from a surface of the semiconductor layer to pass through the body region so that a deepest portion of the trench reaches the first conductivity type region; a gate insulating film disposed on a bottom surface and a side surface of the trench; a gate electrode having a gate width, and disposed in the trench on the gate insulating film; a source region of the first conductivity type disposed on a side of the trench in a surface layer portion of the semiconductor layer so as to be in contact with the body region; a high-concentration region of the second conductivity type disposed in the body region at a position opposed to the trench and having a higher second conductivity type impurity concentration than that of the body region; and a channel implant region, containing a first conductivity type impurity, disposed in the body region between the trench and the high-concentration region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification