Multichip semiconductor device, chip therefor and method of formation thereof
First Claim
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1. A multichip semiconductor device having a stack of chips each having a semiconductor substrate which has a surface on which circuit components are formed, wherein at least one chip of the chips includes:
- a first interlayer insulating film formed above the surface of the semiconductor substrate,a connect plug formed entirely in a through hole which passes through the semiconductor substrate and the first interlayer insulating film,a second interlayer insulating film formed on the first interlayer insulating film, anda metal interconnection which passes through the second interlayer insulating film and which connects to a portion of the connect plug, an area of the portion being smaller than a cross-sectional area of the connect plug, andthe connect plug of the at least one chip is electrically connected to another chip of the chips.
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Abstract
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
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Citations
16 Claims
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1. A multichip semiconductor device having a stack of chips each having a semiconductor substrate which has a surface on which circuit components are formed, wherein at least one chip of the chips includes:
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a first interlayer insulating film formed above the surface of the semiconductor substrate, a connect plug formed entirely in a through hole which passes through the semiconductor substrate and the first interlayer insulating film, a second interlayer insulating film formed on the first interlayer insulating film, and a metal interconnection which passes through the second interlayer insulating film and which connects to a portion of the connect plug, an area of the portion being smaller than a cross-sectional area of the connect plug, and the connect plug of the at least one chip is electrically connected to another chip of the chips. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A chip for use in a multichip semiconductor device comprising:
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a semiconductor substrate having a surface on which circuit components are formed; a first interlayer insulating film formed above the surface of the semiconductor substrate; a connect plug made of a metal formed entirely in a through hole that passes through the first interlayer insulating film and the semiconductor substrate, wherein the connect plug is to be electrically connected to another chip; a second interlayer insulating film formed on the first interlayer insulating film; and a metal interconnection which passes through the second interlayer insulating film and which connects to a portion of the connect plug, an area of the portion being smaller than a cross-sectional area of the connect plug. - View Dependent Claims (9, 10)
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11. A multichip semiconductor device having a stack of chips each having a semiconductor substrate which has a surface on which circuit components are formed, wherein at least one chip of the chips includes:
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a first interlayer insulating film formed above the surface of the semiconductor substrate, a connect plug formed entirely in a through hole which passes through the semiconductor substrate and the first interlayer insulating film, a second interlayer insulating film formed on the first interlayer insulating film, and a metal interconnection which passes through the second interlayer insulating film and which connects to a portion of the connect plug, an area of the portion being smaller than a cross-sectional area of the connect plug, and the connect plug of the at least one chip is connected to another chip of the chips. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification