Substrate handler, lithographic apparatus and device manufacturing method

• US 8,174,680 B2
• Filed: 07/30/2009
• Issued: 05/08/2012
• Est. Priority Date: 07/06/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Van Der Schoot, Harmen Klaas, Jacobs, Hernes, Luttikhuis, Bernardus Antonius Johannes, Vosters, Petrus Matthijs Henricus, Hazenberg, Johannes Martinus Andreas, Van Beuzekom, Aart Adrianus
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US12/512,220
• Publication Number:
  US 20090284730A1
• Time in Patent Office: 1,013 Days
• Field of Search: 355/30, 355/53, 355 72- 76, 118722-725
• US Class Current: 355/72
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Abstract

An apparatus, method, and system is provided to condition a substrate. The apparatus can include a substrate handler, an array of diodes, and a projection system. The substrate handler can include a conditioning device, a float device, and a displacing device. The array of diodes can be configured to provide a patterned radiation beam, where the projection system projects the patterned radiation beam onto a target portion of a conditioned substrate.

Claims

1. An apparatus comprising:

a conditioning device configured to condition a substrate on a support surface;

a float device configured to provide an air bed above the support surface, wherein the float device is configured to float the substrate on the air bed during conditioning of the substrate;

a displacing device configured to displace the substrate, during the conditioning, from one conditioning position to one or more other conditioning positions;

a pattern generating device having an emissive portion configured to produce a patterned beam; and

a projection system configured to project the patterned beam onto a target portion of the conditioned substrate.

2. The apparatus of claim 1, further comprising:

a substrate table configured to receive the conditioned substrate from a substrate handler; and

a conveyor device configured to load the conditioned substrate from the substrate handler to the substrate table.

3. The apparatus of claim 2, wherein the conveyor device is configured to move the conditioned substrate in a plane substantially parallel to a support plane of the substrate table.

4. The apparatus of claim 1, wherein the displacing device is configured to continuously move the substrate during the conditioning.

5. The apparatus of claim 1, wherein the displacing device comprises a gripping device configured to grip the substrate for moving the substrate in a direction substantially parallel to the support surface.

6. The apparatus of claim 1, wherein the float device is configured to maintain a float height of about 0.01-0.15 mm above the support surface during the conditioning.

7. The apparatus of claim 1, wherein the emissive portion comprises an array of diodes.

8. The apparatus of claim 1, wherein the pattern generating device is configured to provide the patterned beam for the target portion of the conditioned substrate that corresponds to a functional layer of a device to be created in the target portion.

9. A method comprising:

conditioning a substrate on a support surface;

providing an air bed above the support surface, wherein the substrate floats on the air bed during conditioning of the substrate;

displacing the substrate from one conditioning position to one or more other conditioning positions during the conditioning;

producing a patterned beam; and

projecting the patterned beam onto a target portion of the conditioned substrate.

10. The method of claim 9, further comprising loading the conditioned substrate onto a substrate table after the conditioning.

11. The method of claim 10, wherein the loading comprises moving the conditioned substrate in a plane substantially parallel to a support plane of the substrate table.

12. The method of claim 9, wherein the displacing comprises continuously moving the substrate during the conditioning.

13. The method of claim 9, wherein providing the air bed comprises gripping the substrate to move the substrate in a direction substantially parallel to the support surface.

14. The method of claim 9, wherein providing the air bed comprises maintaining a float height of about 0.01-0.15 mm above the support surface during the conditioning.

15. The method of claim 9, further comprising using an array of diodes to produce the patterned beam.

16. The method of claim 15, wherein providing the patterned beam comprises providing the patterned beam for the target portion of the conditioned substrate that corresponds to a functional layer of a device to be created in the target portion.

17. A system comprising:

an emissive device configured to produce a patterned beam;

a substrate table configured to support a substrate;

a projection system configured to project the patterned beam onto a target portion of the substrate supported on the substrate table; and

a substrate handler configured to load the substrate on the substrate table, the substrate handler comprising;

a conditioning device configured to condition the substrate on a support surface;

a float device configured to provide an air bed above the support surface, wherein the float device is configured to float the substrate on the air bed during conditioning of the substrate; and

a displacing device configured to displace the substrate, during the conditioning, from one conditioning position to one or more other conditioning positions.

18. The system of claim 17, wherein the substrate handler further comprises a conveyor device configured to load the conditioned substrate from the substrate handler to the substrate table.

19. The system of claim 18, wherein the conveyor device is configured to move the conditioned substrate in a plane substantially parallel to a support plane of the substrate table.

20. The system of claim 17, wherein the emissive device comprises an array of diodes.

21. The system of claim 17, wherein the emissive device is configured to modulate a cross-section of the patterned beam for the target portion of the substrate that corresponds to a functional layer of a device to be created in the target portion.